View DQ965CO_4969181.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Intel(R) Desktop Board DQ965CO
Technical Product Specification
September 2006 Order Number: D56019-001US
The Intel(R) Desktop Board DQ965CO may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DQ965CO Specification Update.
Revision History
Revision
-001
Revision History
First release of the Specification. Intel(R) Desktop Board DQ965CO Technical Product
Date
September 2006
This product specification applies to only the standard Intel(R) Desktop Board DQ965CO with BIOS identifier CO96510J.86A. Changes to this specification will be published in the Intel Desktop Board DQ965CO Specification Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL(R) PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel(R) desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 5937 Denver, CO 80217-9808 or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333. Intel, the Intel logo, Pentium, and Celeron are registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. Copyright (c) 2006, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel(R) Desktop Board DQ965CO. It describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board DQ965CO and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter 1 2 3 4 5 Description A description of the hardware used on the board A map of the resources of the board The features supported by the BIOS Setup program A description of the BIOS error messages, beep codes, and POST codes Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
INTEGRATOR'S NOTES
Integrator's notes are used to call attention to information that may be useful to system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board DQ965CO Technical Product Specification
Other Common Notation
# GB GB/sec Gbit KB Kbit kbits/sec MB MB/sec Mbit Mbit/sec xxh x.x V * Used after a signal name to identify an active-low signal (such as USBP0#). Gigabyte (1,073,741,824 bytes) Gigabytes per second Gigabit (1, 073,741,824 bits) Kilobyte (1024 bytes) Kilobit (1024 bits) 1000 bits per second Megabyte (1,048,576 bytes) Megabytes per second Megabit (1,048,576 bits) Megabits per second An address or data value ending with a lowercase h indicates a hexadecimal value. Volts. Voltages are DC unless otherwise specified. This symbol is used to indicate third-party brands and names that are the property of their respective owners.
iv
Contents
1 Product Description
1.1 Overview........................................................................................ 12 1.1.1 Feature Summary ................................................................ 12 1.1.2 Manufacturing Options .......................................................... 13 1.1.3 Board Layout ....................................................................... 14 1.1.4 Block Diagram ..................................................................... 16 1.2 Online Support................................................................................ 17 1.3 Processor ....................................................................................... 17 1.4 System Memory .............................................................................. 18 1.4.1 Memory Configurations ......................................................... 20 1.5 Intel(R) Virtualization Technology (Intel(R) VT) ........................................ 25 1.6 Intel(R) vProTM Technology Support ...................................................... 26 1.7 Intel(R) Q965 Express Chipset ............................................................. 27 1.7.1 Intel Q965 Graphics Subsystem.............................................. 27 1.7.2 USB ................................................................................... 30 1.7.3 Serial ATA Interfaces ............................................................ 30 1.7.4 Parallel IDE Interface ............................................................ 31 1.7.5 Real-Time Clock, CMOS SRAM, and Battery .............................. 32 1.8 Legacy I/O Controller ....................................................................... 32 1.8.1 Serial Port Interface.............................................................. 32 1.8.2 Parallel Port Interface ........................................................... 33 1.8.3 Diskette Drive Interface ........................................................ 33 1.8.4 PS/2 Keyboard and Mouse Interface (Optional) ......................... 33 1.9 Audio Subsystem............................................................................. 34 1.9.1 Audio Subsystem Software .................................................... 34 1.9.2 Audio Connectors and Headers ............................................... 35 1.10 LAN Subsystem ............................................................................... 36 1.10.1 Intel(R) 82566DM Gigabit Ethernet Controller ............................. 36 1.10.2 LAN Subsystem Software....................................................... 36 1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................. 37 1.10.4 Intel(R) Active Management Technology (Intel(R) AMT) with System Defense Feature................................................. 37 1.10.5 Alert Standard Format (ASF) 2.0 Support................................. 38 1.11 Hardware Management Subsystem .................................................... 39 1.11.1 Hardware Monitoring and Fan Control...................................... 39 1.11.2 Fan Monitoring ..................................................................... 39 1.11.3 Chassis Intrusion and Detection.............................................. 39 1.11.4 Thermal Monitoring .............................................................. 40 1.12 Power Management ......................................................................... 41 1.12.1 ACPI .................................................................................. 41 1.12.2 Hardware Support ................................................................ 43 1.13 Trusted Platform Module (TPM).......................................................... 48
v
Intel Desktop Board DQ965CO Technical Product Specification
2 Technical Reference
2.1 Memory Map................................................................................... 49 2.1.1 Addressable Memory............................................................. 49 2.2 DMA Channels................................................................................. 51 2.3 Fixed I/O Map ................................................................................. 52 2.4 PCI Configuration Space Map ............................................................ 53 2.5 Interrupts ...................................................................................... 54 2.6 PCI Interrupt Routing Map ................................................................ 55 2.7 Connectors and Headers................................................................... 56 2.7.1 Back Panel Connectors .......................................................... 57 2.7.2 Component-side Connectors and Headers ................................ 58 2.8 Jumper Block .................................................................................. 67 2.9 Mechanical Considerations ................................................................ 68 2.9.1 Form Factor......................................................................... 68 2.9.2 I/O Shield ........................................................................... 69 2.10 Electrical Considerations ................................................................... 71 2.10.1 DC Loading.......................................................................... 71 2.10.2 Fan Header Current Capability................................................ 71 2.10.3 Add-in Board Considerations .................................................. 72 2.10.4 Power Supply Considerations ................................................. 72 2.11 Thermal Considerations .................................................................... 73 2.12 Reliability ....................................................................................... 75 2.13 Environmental ................................................................................ 76
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 3.2 BIOS Flash Memory Organization ....................................................... 3.3 Resource Configuration .................................................................... 3.3.1 PCI Autoconfiguration ........................................................... 3.3.2 PCI IDE Support................................................................... 3.4 System Management BIOS (SMBIOS)................................................. 3.5 Legacy USB Support ........................................................................ 3.6 BIOS Updates ................................................................................. 3.6.1 Language Support ................................................................ 3.6.2 Custom Splash Screen .......................................................... 3.7 BIOS Recovery................................................................................ 3.8 Boot Options................................................................................... 3.8.1 CD-ROM Boot ...................................................................... 3.8.2 Network Boot....................................................................... 3.8.3 Booting Without Attached Devices........................................... 3.8.4 Changing the Default Boot Device During POST ........................ 3.9 Adjusting Boot Speed....................................................................... 3.9.1 Peripheral Selection and Configuration..................................... 3.9.2 BIOS Boot Optimizations ....................................................... 3.10 BIOS Security Features .................................................................... 77 78 78 78 79 79 80 80 81 81 81 82 82 82 82 82 83 83 83 84
vi
Contents
4 Error Messages and Beep Codes
4.1 4.2 4.3 4.4 Speaker ......................................................................................... 85 BIOS Beep Codes ............................................................................ 85 BIOS Error Messages ....................................................................... 85 Port 80h POST Codes ....................................................................... 86 91 91 92 94 97 98 99
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 5.1.1 Safety Regulations................................................................ 5.1.2 European Union Declaration of Conformity Statement ................ 5.1.3 Product Ecology Statements................................................... 5.1.4 EMC Regulations .................................................................. 5.1.5 Product Certification Markings (Board Level)............................. 5.2 Battery Disposal Information.............................................................
Figures
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. Major Board Components.................................................................. Block Diagram ................................................................................ Memory Channel Configuration and DIMM Configuration........................ Dual Channel (Interleaved) Mode Configuration with Two DIMMs............ Dual Channel (Interleaved) Mode Configuration with Three DIMMs ......... Dual Channel (Interleaved) Mode Configuration with Four DIMMs ........... Single Channel (Asymmetric) Mode Configuration with One DIMM .......... Single Channel (Asymmetric) Mode Configuration with Three DIMMs....... Flex Mode Configuration with Two DIMMs............................................ Front/Back Panel Audio Connector Options .......................................... LAN Connector LED Locations ............................................................ Thermal Sensors and Fan Headers ..................................................... Location of the Onboard Power Indicator LEDs ..................................... Detailed System Memory Address Map ............................................... Back Panel Connectors ..................................................................... Component-side Connectors and Headers ........................................... Connection Diagram for Front Panel Header ........................................ Connection Diagram for Front Panel USB Headers ................................ Connection Diagram for IEEE 1394a Header ........................................ Location of the Jumper Block............................................................. Board Dimensions ........................................................................... I/O Shield Dimensions for Boards with PS/2 Connectors ........................ I/O Shield Dimensions for Boards without PS/2 Connectors ................... Localized High Temperature Zones..................................................... 14 16 20 21 21 22 23 23 24 35 37 40 47 50 57 58 64 66 66 67 68 69 70 74
vii
Intel Desktop Board DQ965CO Technical Product Specification
Tables
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. 41. 42. 43. Feature Summary............................................................................ 12 Manufacturing Options ..................................................................... 13 Board Components Shown in Figure 1 ................................................ 15 Supported Memory Configurations ..................................................... 18 Memory Operating Frequencies ......................................................... 19 DVI Port Status Conditions................................................................ 29 Audio Jack Retasking Support ........................................................... 34 LAN Connector LED States ................................................................ 37 Effects of Pressing the Power Switch .................................................. 41 Power States and Targeted System Power........................................... 42 Wake-up Devices and Events ............................................................ 43 System Memory Map ....................................................................... 51 DMA Channels................................................................................. 51 I/O Map ......................................................................................... 52 PCI Configuration Space Map ............................................................ 53 Interrupts ...................................................................................... 54 PCI Interrupt Routing Map ................................................................ 55 Component-side Connectors and Headers Shown in Figure 16................ 59 High Definition Audio Link Header ...................................................... 60 Serial ATA Connectors ...................................................................... 60 Chassis Intrusion Header .................................................................. 60 Serial Port Header ........................................................................... 60 Parallel Port Header ......................................................................... 61 Front and Rear Chassis Fan Headers .................................................. 61 Processor Fan Header ...................................................................... 61 Front Panel Audio Header ................................................................. 61 Processor Core Power Connector........................................................ 63 Main Power Connector...................................................................... 63 Front Panel Header .......................................................................... 64 States for a One-Color Power LED ...................................................... 65 States for a Two-Color Power LED...................................................... 65 Auxiliary Front Panel Power LED Header.............................................. 65 BIOS Setup Configuration Jumper Settings.......................................... 67 DC Loading Characteristics ............................................................... 71 Fan Header Current Capability........................................................... 71 Thermal Considerations for Components ............................................. 75 Desktop Board DQ965CO Environmental Specifications ......................... 76 BIOS Setup Program Menu Bar.......................................................... 78 BIOS Setup Program Function Keys.................................................... 78 Acceptable Drives/Media Types for BIOS Recovery ............................... 81 Boot Device Menu Options ................................................................ 82 Supervisor and User Password Functions............................................. 84 Beep Codes .................................................................................... 85
viii
Contents
44. 45. 46. 47. 48. 49. 50. 51.
BIOS Error Messages ....................................................................... Port 80h POST Code Ranges.............................................................. Port 80h POST Codes ....................................................................... Typical Port 80h POST Sequence........................................................ Safety Regulations........................................................................... Lead-Free Board Markings ................................................................ EMC Regulations ............................................................................. Product Certification Markings ...........................................................
85 86 87 90 91 96 97 98
ix
Intel Desktop Board DQ965CO Technical Product Specification
x
1
Product Description
What This Chapter Contains
1.1 Overview........................................................................................ 12 1.2 Online Support................................................................................ 17 1.3 Processor ....................................................................................... 17 1.4 System Memory .............................................................................. 18 1.5 Intel(R) Virtualization Technology (Intel(R) VT) ........................................ 25 1.6 Intel(R) vProTM Technology Support ...................................................... 26 1.7 Intel(R) Q965 Express Chipset ............................................................. 27 1.8 Legacy I/O Controller ....................................................................... 32 1.9 Audio Subsystem............................................................................. 34 1.10 LAN Subsystem ............................................................................... 36 1.11 Hardware Management Subsystem .................................................... 39 1.12 Power Management ......................................................................... 41 1.13 Trusted Platform Module (TPM).......................................................... 48
11
Intel Desktop Board DQ965CO Technical Product Specification
1.1
1.1.1
Overview
Feature Summary
Table 1 summarizes the major features of the Desktop Board DQ965CO. Table 1. Feature Summary
Form Factor Processor microBTX Form Factor (10.40 inches by 10.50 inches [264.16 millimeters by 266.70 millimeters]) Support for the following: * Intel(R) CoreTM2 Duo processor in an LGA775 socket with a 1066 or 800 MHz system bus * Intel(R) Pentium(R) D processor in an LGA775 socket with an 800 or 533 MHz system bus * Intel(R) Pentium(R) 4 processor in an LGA775 socket with an 800 or 533 MHz system bus * Intel(R) Celeron(R) D processor in an LGA775 socket with a 533 MHz system bus Memory * Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets * Support for DDR2 800, DDR2 667, or DDR2 533 MHz DIMMs * Support for up to 8 GB of system memory using DDR2 667 or DDR2 533 DIMMs * Support for up to 4 GB of system memory using DDR2 800 DIMMs Chipset Intel(R) Q965 Express Chipset, consisting of: * Intel(R) 82Q965 Graphics Memory Controller Hub (GMCH) * Intel(R) 82801HO I/O Controller Hub (ICH8DO) Video Audio Legacy I/O Control USB Peripheral Interfaces Intel(R) GMA 3000 onboard graphics subsystem 6-channel (5.1) audio subsystem using the SigmaTel* STAC9227 audio codec Legacy I/O controller for diskette drive, serial, parallel, and optional PS/2* ports Support for USB 2.0 devices * 10 USB ports * Two IEEE-1394a interfaces: one back panel connector and one front-panel header * One serial port * One parallel port * Six Serial ATA interfaces * One Parallel ATA IDE interface with UDMA 33, ATA-66/100/133 support * One diskette drive interface LAN Support BIOS Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel(R) 82566DM Gigabit Ethernet Controller * Intel(R) BIOS (resident in the SPI Flash device) * Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS Trusted Platform Module (TPM), revision 1.2 A component that enhances platform security
continued
12
Product Description
Table 1. Feature Summary (continued)
Instantly Available PC Technology * Support for PCI Local Bus Specification Revision 2.3 * Support for PCI Express* Revision 1.0a * Suspend to RAM support * Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports Expansion Capabilities Hardware Monitor Subsystem * Two PCI Conventional* bus connectors * One PCI Express x1 bus add-in card connector * One PCI Express x16 bus add-in card connector * Intel(R) Quiet System Technology implemented through the ICH8 Manageability Engine * Voltage sense to detect out of range power supply voltages * Thermal sense to detect out of range thermal values * Three fan headers * Three fan sense inputs used to monitor fan activity Intel(R) vProTM Technology support Provides remote management, improved security, and energy-efficient performance
1.1.2
Manufacturing Options
Table 2 describes the manufacturing options. Not every manufacturing option is available in all marketing channels. Please contact your Intel representative to determine which manufacturing options are available to you. Table 2. Manufacturing Options
PS/2 ports Back panel PS/2 ports for mouse and keyboard connection
For information about
Available configurations for the Desktop Board DQ965CO
Refer to
Section 1.2, page 17
13
Intel Desktop Board DQ965CO Technical Product Specification
1.1.3
Board Layout
Figure 1 shows the location of the major components.
A FGH
DD CC BB AA Z D B C E
I J
K
L
Y X
M
W
V
U
T
S
R
QP O
N
OM18313
Figure 1. Major Board Components Table 3 lists the components identified in Figure 1.
14
Product Description
Table 3. Board Components Shown in Figure 1
Item/callout from Figure 1
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA BB CC DD
Description
Back panel connectors High Definition Audio header Remote thermal sensor Serial ATA connectors [6] Front panel USB headers [2] Intel 82801HO I/O Controller Hub (ICH8DO) Chassis intrusion header PCI Express x16 connector PCI Express x1 connector PCI Conventional bus add-in card connectors [2] IEEE-1394a front panel header Diskette drive connector Parallel ATE IDE connector Serial port header Front panel header Front chassis fan header Auxiliary front panel power LED header Parallel port header Speaker LGA775 processor socket Intel 82Q965 GMCH Processor core power connector Processor fan header DIMM Channel A sockets DIMM Channel B sockets Rear chassis fan header Battery Main Power connector BIOS Setup configuration jumper block Front panel audio header
15
Intel Desktop Board DQ965CO Technical Product Specification
1.1.4
Block Diagram
Figure 2 is a block diagram of the major functional areas.
PCI Express x1 Interface PCI Express x1 Slot 1 USB Parallel ATA IDE Connector LGA775 Processor Socket PCI Express x16 Connector PCI Express x16 Interface Display Interface VGA Port DVI Port Channel A DIMMs (2) Channel B DIMMs (2) Dual-Channel Memory Bus High Definition Audio Link SMBus DMI Interconnect
Intel Q965 Express Chipset
Gigabit Ethernet Controller
LAN Connector Back Panel/Front Panel USB Ports Serial Port
Parallel ATA IDE Controller System Bus (1066/800/533 MHz)
Legacy I/O Controller
Parallel Port PS/2 Mouse* PS/2 Keyboard*
LPC Bus
Diskette Drive Connector
Intel 82Q965 Graphics and Memory Controller Hub (GMCH)
Intel 82801HO I/O Controller Hub (ICH8DO)
Serial Peripheral Interface (SPI) Flash Device
LPC Bus
TPM Component
Serial ATA IDE Interface
Serial ATA IDE Connectors (6)
IEEE-1394a Connector/Header
IEEE-1394a Controller PCI Bus
PCI Bus
Mic In Audio Codec Line Out Line In/Retasking Jack Line Out/Retasking Jack Mic In/Retasking Jack
PCI Slot 1 PCI Slot 2 SMBus
* = Optional
High Definition Audio Link Header
OM18482
Figure 2. Block Diagram
16
Product Description
1.2
Online Support
To find information about...
Intel(R) Desktop Board DQ965CO under "Desktop Board Products" or "Desktop Board Support" Available configurations for the Desktop Board DQ965CO Processor data sheets ICH8DO addressing Audio software and utilities LAN software and drivers Supported video modes
Visit this World Wide Web site:
http://www.intel.com/design/motherbd http://support.intel.com/support/motherboards/desktop http://developer.intel.com/design/motherbd/co/co_available.htm http://www.intel.com/products/index.htm http://developer.intel.com/design/chipsets/datashts http://www.intel.com/design/motherbd http://www.intel.com/design/motherbd http://www.intel.com/design/motherbd/co/co_documentation.htm
1.3
* * * *
Processor
Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz system bus Intel Pentium D processor in an LGA775 processor socket with an 800 or 533 MHz system bus Intel Pentium 4 processor in an LGA775 processor socket with an 800 or 533 MHz system bus Intel Celeron D processor in an LGA775 processor socket with a 533 MHz system bus
The board is designed to support the following processors:
See the Intel web site listed below for the most up-to-date list of supported processors.
For information about...
Supported processors
Refer to:
http://www.intel.com/design/motherbd/co/co_proc.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can damage the board, the processor, and the power supply.
INTEGRATOR'S NOTE
Use only ATX12V-compliant power supplies.
For information about
Power supply connectors
Refer to
Section 2.7.2.2, page 63
17
Intel Desktop Board DQ965CO Technical Product Specification
1.4
* * *
System Memory
1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMS with x16 organization are not supported. 8 GB maximum total system memory using DDR2 667 or DDR2 533 DIMMs; 4 GB maximum total system memory using DDR2 800 DIMMs. Refer to Section 2.1.1 on page 49 for information on the total amount of addressable memory. Minimum total system memory: 512 MB Non-ECC DIMMs Serial Presence Detect DDR2 800, DDR2 667, or DDR2 533 MHz SDRAM DIMMs DDR2 800 DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP)
The board has four DIMM sockets and supports the following memory features:
* * * * *
NOTE
A minimum of 512 MB of system memory is required to fully enable both the onboard graphics and the manageability engine.
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This enables the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency. Table 4 lists the supported DIMM configurations. Table 4. Supported Memory Configurations
Smallest usable DIMM (one x16 Single-sided DIMM)
128 MB 256 MB 512 MB 128 MB 256 MB 512 MB 128 MB 256 MB
DIMM Type
DDR2 533 DDR2 533 DDR2 533 DDR2 667 DDR2 667 DDR2 667 DDR2 800 DDR2 800
SDRAM Technology
256 Mbit 512 Mbit 1 Gbit 256 Mbit 512 Mbit 1 Gbit 256 Mbit 512 Mbit
Largest usable DIMM (one x8 Double-sided DIMM)
512 MB 1 GB 2 GB 512 MB 1 GB 2 GB 512 MB 1 GB
Maximum capacity with four identical x8 Double-sided DIMMs
2 GB 4 GB 8 GB 2 GB 4 GB 8 GB 2 GB 4 GB
18
Product Description
NOTE
Regardless of the DIMM type used, the memory frequency will either be equal to or less than the processor system bus frequency. For example, if DDR2 800 memory is used with a 533 MHz system bus frequency processor, the memory will operate at 533 MHz. Table 5 lists the resulting operating memory frequencies based on the combination of DIMMs and processors. Table 5. Memory Operating Frequencies
DIMM Type
DDR2 533 DDR2 533 DDR2 533 DDR2 667 DDR2 667 DDR2 667 DDR2 800 DDR2 800 DDR2 800
Processor system bus frequency
533 MHz 800 MHz 1066 MHz 533 MHz 800 MHz 1066 MHz 533 MHz 800 MHz 1066 MHz
Resulting memory frequency
533 MHz 533 MHz 533 MHz 533 MHz 667 MHz 667 MHz 533 MHz 800 MHz 800 MHz
19
Intel Desktop Board DQ965CO Technical Product Specification
1.4.1
*
Memory Configurations
Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used. Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used. Flex mode. This mode provides the most flexible performance characteristics. The bottommost DRAM memory (the memory that is lowest within the system memory map) is mapped to dual channel operation; the topmost DRAM memory (the memory that is nearest to the 8 GB address space limit), if any, is mapped to single channel operation. Flex mode results in multiple zones of dual and single channel operation across the whole of DRAM memory. To use flex mode, it is necessary to populate both channels.
The Intel 82Q965 GMCH supports the following types of memory organization:
*
*
Figure 3 illustrates the memory channel and DIMM configuration.
NOTE
The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels are black.
Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1
OM18322
Figure 3. Memory Channel Configuration and DIMM Configuration
20
Product Description
INTEGRATOR'S NOTE
Regardless of the memory configuration used (dual channel, single channel, or flex mode), DIMM 0 of Channel A must always be populated. This is a requirement of the ICH8 Manageability Engine feature.
1.4.1.1
Dual Channel (Interleaved) Mode Configurations
Figure 4 shows a dual channel configuration using two DIMMs. In this example, the DIMM0 (blue) sockets of both channels are populated with identical DIMMs.
1 GB
Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1
1 GB
OM18323
Figure 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs
Figure 5 shows a dual channel configuration using three DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the capacity of the single DIMM in the DIMM0 (blue) socket of Channel B.
256 MB 256 MB 512 MB
Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1
OM18324
Figure 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs
21
Intel Desktop Board DQ965CO Technical Product Specification
Figure 6 shows a dual channel configuration using four DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels.
256 MB 512 MB 256 MB 512 MB
Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1
OM18325
Figure 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs
22
Product Description
1.4.1.2 NOTE
Single Channel (Asymmetric) Mode Configurations
Dual channel (Interleaved) mode configurations provide the highest memory throughput. Figure 7 shows a single channel configuration using one DIMM. In this example, only the DIMM0 (blue) socket of Channel A is populated. Channel B is not populated.
512 MB
Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1
OM18326
Figure 7. Single Channel (Asymmetric) Mode Configuration with One DIMM
Figure 8 shows a single channel configuration using three DIMMs. In this example, the combined capacity of the two DIMMs in Channel A does not equal the capacity of the single DIMM in the DIMM0 (blue) socket of Channel B.
256 MB 512 MB 512 MB
Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1
OM18327
Figure 8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs
23
Intel Desktop Board DQ965CO Technical Product Specification
1.4.1.3 NOTE
Flex Mode Configuration
The use of flex mode requires DIMMs to be installed in both channels. Figure 9 shows a flex mode configuration using two DIMMs. The operation is as follows: * * The 512 MB DIMM in the Channel A, DIMM 0 socket and the lower 512 MB of the DIMM in the Channel B, DIMM 0 socket operate together in dual channel mode. The remaining (upper) 512 MB of the DIMM in Channel B operates in single channel mode.
512 MB
Channel A, DIMM 0 Channel A, DIMM 1 Channel B, DIMM 0 Channel B, DIMM 1
1 GB
OM18405
Figure 9. Flex Mode Configuration with Two DIMMs
24
Product Description
1.5
Intel(R) Virtualization Technology (Intel(R) VT)
Virtualization is a proven technology that enables one computer to function as multiple "virtual" systems. It enables multiple operating systems and application stacks to be hosted in logically isolated partitions -- also known as virtual machines. Partitions are independent virtualized environments within the same PC with shared, prioritized access to system hardware. Platform resources, such as processors, memory, storage, and network adapters can be allocated and prioritized for the different partitions to meet specific business and application requirements. Intel(R) Virtualization Technology (Intel(R) VT) offers silicon-level support for core virtualization processes and a new, dedicated space in the software stack for an Intel(R) Lightweight Virtual Machine Monitor (Intel(R) LVMM) -- a software layer that controls and prioritizes each partition's access to the system hardware. Intel provides the virtualization capability within Intel Virtualization Technologyenabled processors and validated chipsets. An Intel Virtualization Technology-enabled BIOS is also needed. Standard memory, storage, and graphics cards work with the Intel Virtualization Technology solution. However, because the quality and amount of such system resources directly affect virtualization performance, it is advisable to be generous in these areas. Using an Intel(R) network adapter and compatible driver ensures the ability to take advantage of the advanced security and manageability capabilities of Intel Virtualization Technology. A Virtual Machine Monitor enabled for Intel Virtualization Technology, such as Intel LVMM, is also required. Intel LVMM is available to Independent Software Vendors (ISVs). After the system hardware and Intel LVMM are in place, Intel Virtualization Technology-enabled applications will need to be installed to take advantage of the built-in hardware capabilities of Intel Virtualization Technology and the virtualization enhancement of Intel LVMM.
For information about
Intel Virtualization Technology
Refer to
http://www.intel.com/go/dovirtualization/
INTEGRATOR'S NOTE
Intel Virtualization Technology-based platforms require system hardware, virtualization software, and applications that are enabled for Intel Virtualization Technology. Individual PC manufacturers will determine whether to ship their platforms with Intel Virtualization Technology enabled or disabled by default. Also, each PC manufacturer may choose to ship Intel LVMM already installed on their platforms or on separate CD-ROMs.
25
Intel Desktop Board DQ965CO Technical Product Specification
1.6
Intel(R) vProTM Technology Support
The board supports Intel vPro technology, Intel's platform for the digital office. Intel vPro technology with Active Management Technology provides remote management, improved security, and energy-efficient performance. The management engine microcontroller in the Intel Q965 Express Chipset provides remote hardware management capabilities regardless of the state of the operating system. The embedded packet filters and sensors in ICH8DO provide enhanced security features customizable through third party applications.
INTEGRATOR'S NOTE
In addition to the hardware support on the board (the Intel 82801HO ICH8DO and the Intel 82566DM Gigabit Ethernet Controller), Intel vPro technology requires the use of an Intel Core 2 Duo processor and compatible third-party applications.
For information about
Intel vPro technology and compatible third-party applications
Refer to
http://www.intel.com/vpro/
26
Product Description
1.7
* *
Intel(R) Q965 Express Chipset
Intel 82Q965 Graphics and Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect Intel 82801HO I/O Controller Hub (ICH8DO) with DMI interconnect
The Intel Q965 Express chipset consists of the following devices:
The GMCH component provides interfaces to the CPU, memory, PCI Express, and the DMI interconnect. The component also provides integrated graphics capabilities supporting 3D, 2D and display capabilities. The ICH8DO is a centralized controller for the board's I/O paths.
For information about
The Intel Q965 Express chipset Resources used by the chipset
Refer to
http://developer.intel.com/ Chapter 2
1.7.1
Intel Q965 Graphics Subsystem
The Intel Q965 Express chipset contains two separate, mutually exclusive graphics options. Either the GMA 3000 graphics controller (contained within the 82Q965 GMCH) is used, or a PCI Express x16 add-in card can be used. When a PCI Express x16 add-in card is installed, the GMA 3000 graphics controller is disabled.
1.7.1.1
* * *
Intel(R) GMA 3000 Graphics Controller
The Intel GMA 3000 graphics controller features the following: 667 MHz core frequency High performance 3-D setup and render engine High quality texture engine DX9.0c* and OpenGL* 1.4 + extensions compliant Vertex Shader Model 2.0 / 3.0 (Software Only) Hardware Pixel Shader 2.0 32-bit and 16-bit Full Precision Floating Point Operations Up to eight Multiple Render Targets (MRTs) Occlusion Query 128-bit floating point texture formats Bilinear, Trilinear, and Anisotropic MipMap filtering Shadow maps and double sided stencils Alpha and luminance maps Texture color-keying/chroma-keying Cubic environment reflection mapping * Enhanced texture blending functions 3D Graphics Rendering enhancements 1.3 dual texture GigaPixel/sec fill rate 16 and 32 bit color
27
Intel Desktop Board DQ965CO Technical Product Specification
Maximum 3D supported resolution of 1600 x 1200 x 32 at 85 Hz Vertex cache Anti-aliased lines * OpenGL version 1.5 support with vertex buffer and EXT_Shadow extensions 2D Graphics enhancements 8, 16, and 32 bit color Optimized 256-bit BLT engine Color space conversion * Anti-aliased lines Video Hardware motion compensation for MPEG2 and HD video Software DVD at 30 fps full screen * Motion adaptive de-interlacing Display Integrated 24-bit 400 MHz RAMDAC Up to 2048 x 1536 at 75 Hz refresh (QXGA) DVI specification 1.0 compliant Dual independent display options with digital display 180-degree hardware screen rotation Hardware color cursor support Supports TMDS transmitters or TV-out encoders HDCP support DDC2B compliant interface with Advanced Digital Display 2 card or Media Expansion Card (ADD2/MEC), support for TV-out/TV-in and DVI digital display connections Supports flat panels up to 2048 x 1536 at 75 Hz (when in dual-channel mode) or digital CRT/HDTV at 1920 x 1080 at 85 Hz (with ADD2/MEC) Two multiplexed SDVO port interfaces with 270 MHz pixel clocks using an ADD2/MEC card Dynamic Video Memory Technology (DVMT) support up to 256 MB Intel(R) Zoom Utility
* *
1.7.1.2
Dynamic Video Memory Technology (DVMT)
DVMT enables enhanced graphics and memory performance through highly efficient memory utilization. DVMT ensures the most efficient use of available system memory for maximum 2-D/3-D graphics performance. Up to 256 MB of system memory can be allocated to DVMT on systems that have 512 MB or more of total system memory installed. DVMT returns system memory back to the operating system when the additional system memory is no longer required by the graphics subsystem. DVMT will always use a minimal fixed portion of system physical memory (as set in the BIOS Setup program) for compatibility with legacy applications. An example of this would be when using VGA graphics under DOS. Once loaded, the operating system
28
Product Description
and graphics drivers allocate additional system memory to the graphics buffer as needed for performing graphics functions.
NOTE
The use of DVMT requires operating system driver support.
1.7.1.3
Configuration Modes
A list of supported modes for the Intel GMA 3000 graphics controller is available as a downloadable document.
For information about
Supported video modes for the board
Refer to
Section 1.2, page 17
1.7.1.4
Digital Video Interface (DVI)
The DVI port supports only DVI-D displays. If a DVI-I display is connected, only the digital signal will be displayed. The maximum supported resolution is 1600 x 1200 at 60 Hz. The DVI port is compliant with the following specifications: * * DVI 1.0 HDCP rev 1.1 down-stream compliant (when applicable)
Depending on the type of add-in card installed in the PCI Express x16 connector, the DVI port will behave as described in Table 6. Table 6. DVI Port Status Conditions
PCI Express x16 connector status No add-in card installed Non-video PCI Express x1 add-in card installed PCI Express x4, x8, or 16 add-in card installed ADD2 or MEC card installed DVI port status Enabled Enabled Disabled Disabled
1.7.1.5
Advanced Digital Display (ADD2/MEC) Card Support
The GMCH routes two multiplexed SDVO ports that are each capable of driving up to a 200 MHz pixel clock to the PCI Express x16 connector. The SDVO ports can be paired for a dual channel configuration to support up to a 400 MHz pixel clock. When an ADD2/MEC card is detected, the Intel GMA 3000 graphics controller is enabled and the PCI Express x16 connector is configured for SDVO mode. SDVO mode enables the SDVO ports to be accessed by the ADD2/MEC card. An ADD2/MEC card can either be configured to support simultaneous display with the primary VGA display or can be configured to support dual independent display as an extended desktop configuration with different color depths and resolutions. ADD2/MEC cards can be designed to support the following configurations: * * * TV-Out (composite video) Transition Minimized Differential Signaling (TMDS) for DVI 1.0 Low Voltage Differential Signaling (LVDS)
29
Intel Desktop Board DQ965CO Technical Product Specification
* * * *
Single device operating in dual channel mode VGA output HDTV output HDMI/UDI support (when used with the HD Audio Link)
1.7.2
USB
The board supports up to 10 USB 2.0 ports, supports UHCI and EHCI, and uses UHCIand EHCI-compatible drivers. The ICH8DO provides the USB controller for all ports. The port arrangement is as follows: * * Six ports are implemented with stacked back panel connectors Four ports are routed to two separate front panel USB headers
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.
For information about
The location of the USB connectors on the back panel The location of the front panel USB headers
Refer to
Figure 15, page 57 Figure 16, page 58
1.7.3
Serial ATA Interfaces
The board provides six Serial ATA (SATA) connectors, which support one device per connector.
1.7.3.1
Serial ATA Support
The ICH8DO's Serial ATA controller offers six independent Serial ATA ports with a theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed on each port for a maximum of six Serial ATA devices. A point-to-point interface is used for host to device connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices per channel. For compatibility, the underlying Serial ATA functionality is transparent to the operating system. The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP and Windows 2000 operating systems.
30
Product Description
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adaptors or power supplies equipped with low-voltage power connectors. For more information, see: http://www.serialata.org/
For information about
The location of the Serial ATA connectors
Refer to
Figure 16, page 58
1.7.3.2
Serial ATA RAID
The ICH8DO supports the following RAID (Redundant Array of Independent Drives) levels: * * * * RAID RAID RAID RAID 0 - data striping 1 - data mirroring 0+1 (or RAID 10) - data striping and mirroring 5 - distributed parity
1.7.4
* * * *
Parallel IDE Interface
Programmed I/O (PIO): processor controls data transfer. 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec. Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 33 MB/sec. ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible. ATA-100: DMA protocol on IDE bus allows host and target throttling. The ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec. ATA-133: DMA protocol on IDE bus allows host and target throttling. The ATA-133 logic is designed to achieve read transfer rates up to 133 MB/sec and write transfer rates in excess of 100 MB/sec.
The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes:
*
*
NOTE
ATA-66, ATA-100, and ATA-133 are faster timings and require a specialized cable to reduce reflections, noise, and inductive coupling. The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives) and ATA devices. The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.
For information about
The location of the Parallel ATA IDE connector
Refer to
Figure 16, page 58
31
Intel Desktop Board DQ965CO Technical Product Specification
1.7.5
Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to 13 minutes/year at 25 C with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on. When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 14 shows the location of the battery.
1.8
* * * * * * *
Legacy I/O Controller
One serial port One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port (EPP) support Serial IRQ interface compatible with serialized IRQ support for PCI systems PS/2-style mouse and keyboard interfaces Interface for one 1.44 MB or 2.88 MB diskette drive Intelligent power management, including a programmable wake-up event interface PCI power management support
The I/O controller provides the following features:
The BIOS Setup program provides configuration options for the I/O controller.
1.8.1
Serial Port Interface
The serial port header is located on the component side of the board. The serial port supports data transfers at speeds up to 115.2 kbits/sec with BIOS support.
For information about
The location of the serial port header
Refer to
Figure 16, page 58
32
Product Description
1.8.2
Parallel Port Interface
The parallel port header is located on the component side of the board. Use the BIOS Setup program to set the parallel port mode.
For information about
The location of the parallel port header
Refer to
Figure 16, page 58
1.8.3
Diskette Drive Interface
The I/O controller supports one diskette drive. Use the BIOS Setup program to configure the diskette drive interface.
For information about
The location of the diskette drive connector
Refer to
Figure 16, page 58
1.8.4
NOTE
PS/2 Keyboard and Mouse Interface (Optional)
The optional PS/2 keyboard and mouse connectors are located on the back panel.
The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is connected or disconnected.
For information about
The location of the optional keyboard and mouse connectors
Refer to
Figure 15, page 57
33
Intel Desktop Board DQ965CO Technical Product Specification
1.9
* * * *
Audio Subsystem
Intel 82801HO ICH8DO Sigmatel STAC9227 audio codec Back panel audio connectors Component-side audio headers: Front panel audio header HD audio link header
The onboard audio subsystem consists of the following:
The audio subsystem supports the following features: * Advanced jack sense for the front/back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port. Within hardware constraints, the back panel audio jacks are capable of retasking according to the user's definition, or can be automatically switched depending on the recognized device type. A signal-to-noise (S/N) ratio of 95 dB
*
Table 7 lists the supported retasking functions of the front panel and back panel audio jacks. Table 7. Audio Jack Retasking Support
Audio Jack
Front panel - Green Front panel - Pink Back panel - Blue Back panel - Green Back panel - Pink
Supports Line in?
Yes Yes Yes No Yes
Supports Line out?
Yes No Yes Yes Yes
Supports Microphone?
No Yes No No Yes
Supports Headphones?
Yes No No Yes No
1.9.1
Audio Subsystem Software
Refer to Section 1.2, page 17
Audio software and drivers are available from Intel's World Wide Web site.
For information about Obtaining audio software and drivers
34
Product Description
1.9.2
Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the component side of the board. The front panel audio header provides mic in and line out signals for the front panel. Microphone bias is supported for both the front and back panel microphone connectors. The front/back panel audio connectors are configurable through the audio device drivers. The available configurable audio ports are shown in Figure 10.
Front Panel Audio Connectors [Routed from Front Panel Audio Header] Back Panel Audio Connectors
Line Out/ Retasking Jack [Green]
Mic In/ Retasking Jack [Pink]
Line In/Retasking Jack [Blue] Line Out/Retasking Jack [Green] Mic In/Retasking Jack [Pink]
OM18469
Figure 10. Front/Back Panel Audio Connector Options
For information about
The location of the front panel audio header The signal names of the front panel audio header The location of the HD Audio Link header The signal names of the HD Audio Link header The back panel audio connectors
Refer to
Figure 16, page 58 Table 26, page 61 Figure 16, page 58 Table 19, page 60 Section 2.7.1, page 57
35
Intel Desktop Board DQ965CO Technical Product Specification
1.10 LAN Subsystem
The LAN subsystem consists of the following: * Intel 82566DM Gigabit (10/100/1000 Mbits/sec) Ethernet LAN controller * Intel 82801HO ICH8DO * RJ-45 LAN connector with integrated status LEDs Additional features of the LAN subsystem include: * CSMA/CD protocol engine * LAN connect interface between ICH8DO and LAN controller * PCI Conventional bus power management Supports ACPI technology Supports LAN wake capabilities LAN Subsystem Software LAN software and drivers are available from Intel's World Wide Web site.
1.10.1
* * * * * * * * * * * *
Intel(R) 82566DM Gigabit Ethernet Controller
The Intel 82566DM Gigabit Ethernet Controller supports the following features: PCI Express link 10/100/1000 IEEE 802.3 compliant Compliant to IEEE 802.3x flow control support Jumbo frame support TCP, IP, UDP checksum offload Transmit TCP segmentation Advanced packet filtering Full device driver compatibility PCI Express Power Management Support Alert Standard Format (ASF) 2.0 Intel(R) Active Management Technology (Intel(R) AMT) Virtual LAN driver support for Intel VT partitions
The Intel 82566DM also provides support for:
1.10.2
LAN Subsystem Software
Refer to Section 1.2, page 17
LAN software and drivers are available from Intel's World Wide Web site.
For information about Obtaining LAN software and drivers
36
Product Description
1.10.3
RJ-45 LAN Connector with Integrated LEDs
Link LED (Green) Data Rate LED (Green/Yellow)
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 11 below).
OM18329
Figure 11. LAN Connector LED Locations Table 8 describes the LED states when the board is powered up and the LAN subsystem is operating. Table 8. LAN Connector LED States
LED
Link
LED Color
Green
LED State
Off On Blinking Off
Condition
LAN link is not established. LAN link is established. LAN activity is occurring. 10 Mbits/sec data rate is selected. 100 Mbits/sec data rate is selected. 1000 Mbits/sec data rate is selected.
Data Rate
Green/Yellow
Green Yellow
1.10.4
Intel(R) Active Management Technology (Intel(R) AMT) with System Defense Feature
Intel Active Management Technology offers IT organizations tamper-resistant and persistent management capabilities. Specifically, Intel AMT is a hardware-based solution that uses out of band communication to manage access client systems in addition to offering encrypted and persistent asset management and remote diagnostics and/or recovery capabilities for networked platforms. With Intel AMT, IT organizations can easily get accurate platform information, and can perform remote updating, diagnostics, debugging and repair of a system, regardless of the state of the operating system and the power state of the system.
NOTE
Software with AMT capability is required to take advantage of Intel AMT platform management capabilities. The key features of Intel AMT include: * * * Secure Out of Band (OOB) system management that allows remote management of PCs regardless of system power or operating system state. Remote troubleshooting and recovery that can significantly reduce desk-side visits and potentially increasing efficiency of IT technical staff. Proactive alerting that decreases downtime and minimizes time to repair.
37
Intel Desktop Board DQ965CO Technical Product Specification
* * *
Third party non-volatile storage that prevents users from removing critical inventory, remote control, or virus protection agents. Remote hardware and software asset tracking that eliminates time-consuming manual inventory tracking, which also reduces asset accounting costs. System Defense Feature - an Intel AMT feature for stopping the propagation of worms and viruses through the use of programmable packet filters in the integrated LAN controller. The packet filters inspect all incoming and all outgoing packets and determine whether to block or pass the packets as configured. There is no indication to the host that a packet has been blocked or accepted.
Refer to http://www.intel.com/technology/manage/iamt/index.htm
For information about Intel Active Management Technology
1.10.5
Alert Standard Format (ASF) 2.0 Support
The board provides the following ASF support for PCI Express x1 bus add-in LAN cards and PCI Conventional bus add-in LAN cards: * Monitoring of system firmware progress events, including: BIOS present Primary processor initialization Memory initialization Video initialization PCI resource configuration Hard-disk initialization User authentication * Starting operating system boot process Monitoring of system firmware error events, including: Memory missing Memory failure No video device Keyboard failure Hard-disk failure * * * No boot media Boot options to boot from different types of boot devices Reset, shutdown, power cycle, and power up options LAN Subsystem Software
LAN software and drivers are available from Intel's World Wide Web site.
38
Product Description
1.11 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: * * * Fan monitoring and control Thermal and voltage monitoring Chassis intrusion detection
1.11.1
* * * * *
Hardware Monitoring and Fan Control
The features of the hardware monitoring and fan control include: Intel Quiet System Technology, delivering acoustically-optimized thermal management Fan speed control controllers and sensors integrated into the ICH8DO Four thermal sensors (processor, 82Q965 GMCH, 82801HO ICH8DO, and a remote thermal sensor) Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.25 V, and +VCCP) to detect levels above or below acceptable values Thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or switch the fans on or off as needed
1.11.2
Fan Monitoring
Fan monitoring can be implemented using Intel Desktop Utilities or third-party software.
For information about
The functions of the fan headers
Refer to
Section 1.12.2.2, page 44
1.11.3
Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion header. When the chassis cover is removed, the mechanical switch is in the closed position.
For information about
The location of the chassis intrusion header
Refer to
Figure 16, page 58
39
Intel Desktop Board DQ965CO Technical Product Specification
1.11.4
Thermal Monitoring
Figure 12 shows the locations of the thermal sensors and fan headers.
C
G
D
E
B
A
F
OM18314
Item A B C D E F G
Description Thermal diode, located on processor die Thermal diode, located on the GMCH die Thermal diode, located on the ICH8DO die Remote thermal sensor Processor fan Front chassis fan Rear chassis fan
Figure 12. Thermal Sensors and Fan Headers
40
Product Description
1.12 Power Management
Power management is implemented at several levels, including: * * Software support through Advanced Configuration and Power Interface (ACPI) Hardware support: Power connector Fan headers LAN wake capabilities Instantly Available PC technology Resume on Ring Wake from USB Wake from PS/2 devices Power Management Event signal (PME#) wake-up support
1.12.1
ACPI
ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with the board requires an operating system that provides full ACPI support. ACPI features include: * * * * * * Plug and Play (including bus and device enumeration) Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state A Soft-off feature that enables the operating system to power-off the computer Support for multiple wake-up events (see Table 11 on page 43) Support for a front panel power and sleep mode switch
Table 9 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system. Table 9. Effects of Pressing the Power Switch
If the system is in this state...
Off (ACPI G2/G5 - Soft off) On (ACPI G0 - working state) On (ACPI G0 - working state) Sleep (ACPI G1 - sleeping state) Sleep (ACPI G1 - sleeping state)
...and the power switch is pressed for
Less than four seconds Less than four seconds More than four seconds Less than four seconds More than four seconds
...the system enters this state
Power-on (ACPI G0 - working state) Soft-off/Standby (ACPI G1 - sleeping state) Fail safe power-off (ACPI G2/G5 - Soft off) Wake-up (ACPI G0 - working state) Power-off (ACPI G2/G5 - Soft off)
41
Intel Desktop Board DQ965CO Technical Product Specification
1.12.1.1
System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state. Table 10 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states. Table 10. Power States and Targeted System Power
Global States
G0 - working state G1 - sleeping state
Sleeping States
S0 - working N/A
Processor States
C0 - working C1 - stop grant
Device States
D0 - working state. D1, D2, D3 - device specification specific. D3 - no power except for wake-up logic. D3 - no power except for wake-up logic. D3 - no power except for wake-up logic. D3 - no power for wake-up logic, except when provided by battery or external source.
Targeted System Power (Note 1)
Full power > 30 W 5 W < power < 52.5 W
G1 - sleeping state G1 - sleeping state G2/S5
S3 - Suspend to RAM. Context saved to RAM. S4 - Suspend to disk. Context saved to disk. S5 - Soft off. Context not saved. Cold boot is required. No power to the system.
No power
Power < 5 W (Note 2)
No power
Power < 5 W (Note 2)
No power
Power < 5 W (Note 2)
G3 - mechanical off. AC power is disconnected from the computer. Notes: 1. 2.
No power
No power to the system. Service can be performed safely.
Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis' power supply. Dependent on the standby power consumption of wake-up devices used in the system.
42
Product Description
1.12.1.2 Two-Watt Standby
In 2001, the U.S. government issued an executive order requiring a reduction in power for appliances and personal computers. This board meets that requirement by operating at 1.5 W (or less) in S5 (Standby) mode. Two-Watt operation applies only to the S5 state when the computer is turned off, but still connected to AC power. Two-Watt operation does not apply to the S3 (Suspend to RAM) or S4 (Suspend to disk) states. Newer energy-efficient power supplies using less than 0.5 W (in Standby mode) may also be needed to achieve this goal.
1.12.1.3
Wake-up Devices and Events
Table 11 lists the devices or specific events that can wake the computer from specific states. Table 11. Wake-up Devices and Events
These devices/events can wake up the computer...
LAN PME# signal Power switch PS/2 devices RTC alarm Serial port USB WAKE# signal
...from this state
S3, S4, S5 (Note) S3, S4, S5 (Note) S3, S4, S5 S3 S3, S4, S5 S3 S3 S3, S4, S5
Note: For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to Power On will enable a wake-up event from LAN in the S5 state.
NOTE
The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events.
1.12.2
Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. The board provides several power management hardware features, including: * * * Power connector Fan headers LAN wake capabilities
43
Intel Desktop Board DQ965CO Technical Product Specification
* * * * * *
Instantly Available PC technology Resume on Ring Wake from USB Wake from PS/2 keyboard PME# signal wake-up support WAKE# signal wake-up support
LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line. Resume on Ring enables telephony devices to access the computer when it is in a power-managed state. The method used depends on the type of telephony device (external or internal).
NOTE
The use of Resume on Ring and Wake from USB technologies from an ACPI state requires an operating system that provides full ACPI support.
1.12.2.1
Power Connector
ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages. When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer's response can be set using the Last Power State feature in the BIOS Setup program's Boot menu.
For information about
The location of the main power connector The signal names of the main power connector
Refer to
Figure 16, page 58 Table 28, page 63
1.12.2.2
* * * * *
Fan Headers
The function/operation of the fan headers is as follows: The fans are on when the board is in the S0 state. The fans are off when the board is off or in the S3, S4, or S5 state. Each fan header is wired to a fan tachometer input of the hardware monitoring and fan control device. All fan headers support closed-loop fan control that can adjust the fan speed or switch the fan on or off as needed. All fan headers have a +12 V DC connection.
Refer to
Figure 12, page 40 Table 25, page 61 Table 24, page 61
For information about
The locations of the fan headers and thermal sensors The signal names of the processor fan header The signal names of the chassis fan headers
44
Product Description
1.12.2.3
LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply. LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem PCI bus network adapter monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer. Depending on the LAN implementation, the board supports LAN wake capabilities with ACPI in the following ways: * * * The PCI Express WAKE# signal The PCI bus PME# signal for PCI 2.3 compliant LAN designs The onboard LAN subsystem
1.12.2.4
Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 11 on page 43 lists the devices and events that can wake the computer from the S3 state. The board supports the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer. The use of Instantly Available PC technology requires operating system support and PCI 2.3 compliant add-in cards and drivers.
45
Intel Desktop Board DQ965CO Technical Product Specification
1.12.2.5
* * *
Resume on Ring
The operation of Resume on Ring can be summarized as follows: Resumes operation from ACPI S3 state Detects incoming call similarly for external and internal modems Requires modem interrupt be unmasked for correct operation
1.12.2.6 NOTE
Wake from USB
USB bus activity wakes the computer from ACPI S3 state.
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.12.2.7
Wake from PS/2 Devices
PS/2 device activity wakes the computer from an ACPI S3 state.
1.12.2.8
PME# Signal Wake-up Support
When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state (with Wake on PME enabled in BIOS).
1.12.2.9
WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state.
46
Product Description
1.12.2.10 Onboard Power Indicator LEDs CAUTION
If AC power has been switched off and the +5 V standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices.
CAUTION
When connected to AC power, the memory slots on the board will be powered on and in use. A red LED (shown in Figure 13), located near the memory slots, will be lit if the memory slots are powered. Installing or removing memory while the memory slots are powered may result in damage to both the memory and the board. Before installing or removing memory, disconnect the computer from AC power and wait for the LED to go off before proceeding. Figure 13 shows the location of the two power indicators: * +5 V standby power indicator LED. The +5 V standby power indicator LED is lit when there is standby power still present even when the computer appears to be off. Memory power indicator LED. The memory power indicator LED is lit when there is power to the memory slots.
*
A
B
OM18491
Item A B
Description +5 V standby power indicator LED Memory power indicator LED
LED color Green Red
Figure 13. Location of the Onboard Power Indicator LEDs
47
Intel Desktop Board DQ965CO Technical Product Specification
1.13 Trusted Platform Module (TPM)
The TPM 1.2 component is specifically designed to enhance platform security aboveand-beyond the capabilities of today's software by providing a protected space for key operations and other security critical tasks. Using both hardware and software, the TPM protects encryption and signature keys at their most vulnerable stages-- operations when the keys are being used unencrypted in plain-text form. The TPM is specifically designed to shield unencrypted keys and platform authentication information from software-based attacks.
For information about
TPM 1.2
Refer to
http://www.intel.com/design/motherbd/co/
48
2
Technical Reference
What This Chapter Contains
2.1 Memory Map................................................................................... 49 2.2 DMA Channels................................................................................. 51 2.3 Fixed I/O Map ................................................................................. 52 2.4 PCI Configuration Space Map ............................................................ 53 2.5 Interrupts ...................................................................................... 54 2.6 PCI Interrupt Routing Map ................................................................ 55 2.7 Connectors and Headers................................................................... 56 2.8 Jumper Block .................................................................................. 67 2.9 Mechanical Considerations ................................................................ 68 2.10 Electrical Considerations ................................................................... 71 2.11 Thermal Considerations .................................................................... 73 2.12 Reliability ....................................................................................... 75 2.13 Environmental ................................................................................ 76
2.1
2.1.1
Memory Map
Addressable Memory
The board utilizes 8 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 8 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following: * * * * * * * * * BIOS/ SPI Flash (16 Mbits) Local APIC (19 MB) Digital Media Interface (40 MB) Front side bus interrupts (17 MB) PCI Express configuration space (256 MB) GMCH base address registers, internal graphics ranges, PCI Express ports (up to 512 MB) Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI Express add-in cards Manageability Engine support (6 MB) Base graphics memory support (1 MB or 8 MB)
49
Intel Desktop Board DQ965CO Technical Product Specification
The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 14 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.
8 GB Top of System Address Space Upper 4 GB of address space FLASH APIC Reserved ~20 MB
PCI Memory Range contains PCI, chipsets, Direct Media Interface (DMI), and ICH ranges (approximately 750 MB)
0FFFFFH 0F0000H 0EFFFFH Top of usable DRAM (memory visible to the operating system)
1 MB Upper BIOS area (64 KB) 960 KB Lower BIOS area (64 KB; 16 KB x 4) 896 KB Add-in Card BIOS and Buffer area (128 KB; 16 KB x 8) 768 KB Standard PCI/ ISA Video Memory (SMM Memory) 128 KB 640 KB DOS area (640 KB)
0E0000H 0DFFFFH
DRAM Range 1 MB DOS Compatibility Memory 640 KB
0C0000H 0BFFFFH
0A0000H 09FFFFH
0 MB
00000H
0 KB
OM18311
Figure 14. Detailed System Memory Address Map
50
Technical Reference
Table 12 lists the system memory map. Table 12. System Memory Map
Address Range (decimal)
1024 K - 8388608 K 960 K - 1024 K 896 K - 960 K 800 K - 896 K
Address Range (hex)
100000 - 1FFFFFFFF F0000 - FFFFF E0000 - EFFFF C8000 - DFFFF
Size
8191 MB 64 KB 64 KB 96 KB
Description
Extended memory Runtime BIOS Reserved Potential available high DOS memory (open to the PCI bus). Dependent on video adapter used. Video memory and BIOS Extended BIOS data (movable by memory manager software) Extended conventional memory Conventional memory
640 K - 800 K 639 K - 640 K 512 K - 639 K 0 K - 512 K
A0000 - C7FFF 9FC00 - 9FFFF 80000 - 9FBFF 00000 - 7FFFF
160 KB 1 KB 127 KB 512 KB
2.2
DMA Channels
DMA Channel Number
0 1 2 3 4 5 6 7
Table 13. DMA Channels
Data Width
8 or 16 bits 8 or 16 bits 8 or 16 bits 8 or 16 bits 8 or 16 bits 16 bits 16 bits 16 bits
System Resource
Open Parallel port Diskette drive Parallel port (for ECP or EPP) DMA controller Open Open Open
51
Intel Desktop Board DQ965CO Technical Product Specification
2.3
Fixed I/O Map
Address (hex)
0000 - 00FF 01F0 - 01F7 0228 - 022F (Note 1) 0278 - 027F (Note 1) 02E8 - 02EF (Note 1) 02F8 - 02FF (Note 1) 0378 - 037F 03B0 - 03BB 03C0 - 03DF 03E8 - 03EF 03F0 - 03F5 03F4 - 03F7 03F8 - 03FF 04D0 - 04D1 LPTn + 400 0CF8 - 0CFB (Note 2) 0CF9 (Note 3) 0CFC - 0CFF FFA0 - FFA7
Table 14. I/O Map
Size
256 bytes 8 bytes 8 bytes 8 bytes 8 bytes 8 bytes 8 bytes 12 bytes 32 bytes 8 bytes 6 bytes 4 bytes 8 bytes 2 bytes 8 bytes 4 bytes 1 byte 4 bytes 8 bytes
Description
Used by the Desktop Board DQ965CO. Refer to the ICH8DO data sheet for dynamic addressing information. Primary Parallel ATE IDE channel command block LPT3 LPT2 COM4 COM2 LPT1 Intel 82Q965 GMCH Intel 82Q965 GMCH COM3 Diskette channel Primary Parallel ATA IDE channel control block COM1 Edge/level triggered PIC ECP port, LPTn base address + 400h PCI configuration address register Reset control register PCI configuration data register Primary Parallel ATA IDE bus master registers
Notes: 1. 2. 3. Default, but can be changed to another address range Dword access only Byte access only
NOTE
Some additional I/O addresses are not available due to ICH8DO address aliasing. The ICH8DO data sheet provides more information on address aliasing.
For information about
Obtaining the ICH8DO data sheet
Refer to
Section 1.2 on page 17
52
Technical Reference
2.4
PCI Configuration Space Map
Bus Number (hex)
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
(Note 2) (Note 2) (Note 2)
Table 15. PCI Configuration Space Map
Device Number (hex)
00 01 02 1B 1C 1C 1C 1C 1C 1D 1D 1D 1D 1A 1D 1A 1E 1F 1F 1F 1F 1F 19 00 01 03 00
Function Number (hex)
00 00 00 00 00 01 02 03 04 00 01 02 00 01 07 07 00 00 01 02 05 03 00 00 00 00 00
Description
Memory controller of Intel 82Q965 component PCI Express x16 graphics port (Note 1) Integrated graphics controller Intel High Definition Audio Controller PCI Express port 1 PCI Express port 2 PCI Express port 3 PCI Express port 4 PCI Express port 5 USB UHCI controller 1 USB UHCI controller 2 USB UHCI controller 3 USB UHCI controller 4 USB UHCI controller 5 EHCI controller #1 EHCI controller #2 PCI bridge PCI controller Parallel ATA IDE controller Serial ATA controller #1 Serial ATA controller #2 SMBus controller Gigabit LAN controller PCI Conventional bus connector 1 PCI Conventional bus connector 2 IEEE-1394a controller PCI Express video controller (Note 1)
01 Notes:
1. Present only when a PCI Express x16 graphics card is installed. 2. Bus number is dynamic and can change based on add-in cards used.
53
Intel Desktop Board DQ965CO Technical Product Specification
2.5
Interrupts
The interrupts can be routed through either the Programmable Interrupt Controller (PIC) or the Advanced Programmable Interrupt Controller (APIC) portion of the ICH8DO component. The PIC is supported in Windows 98 SE and Windows ME and uses the first 16 interrupts. The APIC is supported in Windows 2000 and Windows XP and supports a total of 24 interrupts. Table 16. Interrupts
IRQ
NMI 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 (Note 2) 17 (Note 2) 18 (Note 2) 19 (Note 2) 20 (Note 2) 21 (Note 2) 22 (Note 2) 23 (Note 2) Notes: 1. Default, but can be changed to another IRQ. 2. Available in APIC mode only.
System Resource
I/O channel check Reserved, interval timer Reserved, keyboard buffer full Reserved, cascade interrupt from slave PIC COM2 (Note 1) COM1 (Note 1) LPT2 (Plug and Play option)/User available Diskette drive LPT1 (Note 1) Real-time clock Reserved for ICH8DO system management bus User available User available Onboard mouse port (if present, else user available) Reserved, math coprocessor Primary IDE/Serial ATA (if present, else user available) Secondary IDE/Serial ATA (if present, else user available) USB UHCI controller 1 / USB UHCI controller 4 (through PIRQA) AC `97 audio/modem/User available (through PIRQB) ICH8DO USB controller 3 (through PIRQC) ICH8DO USB controller 2 (through PIRQD) ICH8DO LAN (through PIRQE) User available (through PIRQF) User available (through PIRQG) ICH8DO USB 2.0 EHCI controller/User available (through PIRQH)
54
Technical Reference
2.6
PCI Interrupt Routing Map
This section describes interrupt sharing and how the interrupt signals are connected between the PCI bus connectors and onboard PCI devices. The PCI specification specifies how interrupts can be shared between devices attached to the PCI bus. In most cases, the small amount of latency added by interrupt sharing does not affect the operation or throughput of the devices. In some special cases where maximum performance is needed from a device, a PCI device should not share an interrupt with other PCI devices. Use the following information to avoid sharing an interrupt with a PCI add-in card. PCI devices are categorized as follows to specify their interrupt grouping: * INTA: By default, all add-in cards that require only one interrupt are in this category. For almost all cards that require more than one interrupt, the first interrupt on the card is also classified as INTA. INTB: Generally, the second interrupt on add-in cards that require two or more interrupts is classified as INTB. (This is not an absolute requirement.) INTC and INTD: Generally, a third interrupt on add-in cards is classified as INTC and a fourth interrupt is classified as INTD.
* *
The ICH8DO has eight Programmable Interrupt Request (PIRQ) input signals. All PCI interrupt sources either onboard or from a PCI add-in card connect to one of these PIRQ signals. Some PCI interrupt sources are electrically tied together on the board and therefore share the same interrupt. Table 17 shows an example of how the PIRQ signals are routed. Table 17. PCI Interrupt Routing Map
ICH8DO PIRQ Signal Name PCI Interrupt Source
ICH8DO LAN PCI bus connector 1 PCI bus connector 2 IEEE-1394a controller INTA
PIRQA PIRQB PIRQC PIRQD PIRQE PIRQF PIRQG PIRQH
INTA INTD INTC INTA INTB INTB INTA INTC INTD
NOTE
In PIC mode, the ICH8DO can connect each PIRQ line internally to one of the IRQ signals (3, 4, 5, 6, 7, 9, 10, 11, 12, 14, and 15). Typically, a device that does not share a PIRQ line will have a unique interrupt. However, in certain interruptconstrained situations, it is possible for two or more of the PIRQ lines to be connected to the same IRQ signal. Refer to Table 16 for the allocation of PIRQ lines to IRQ signals in APIC mode. PCI interrupt assignments to USB ports, Serial ATA ports, and PCI Express ports are dynamic.
55
Intel Desktop Board DQ965CO Technical Product Specification
2.7
Connectors and Headers
CAUTION
Only the following connectors have overcurrent protection: Back panel and front panel USB, PS/2, and VGA. The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer's chassis, such as fans and internal peripherals. Do not use these connectors/headers to power devices external to the computer's chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves. This section describes the board's connectors and headers. The connectors and headers can be divided into these groups: * * Back panel I/O connectors (see page 57) Component-side connectors and headers (see page 58)
56
Technical Reference
2.7.1
Back Panel Connectors
Figure 15 shows the locations of the back panel connectors.
A C F H J
B
D
Item A B C D E F G H I J K L
E
G
I
K
L
OM18312
Description VGA port DVI-D connector (digital output only) PS/2 mouse port (optional) PS/2 keyboard port (optional) USB ports [2] IEEE-1394a USB ports [2] LAN USB ports [2] Audio line in Mic in Audio line out
Figure 15. Back Panel Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
57
Intel Desktop Board DQ965CO Technical Product Specification
2.7.2
Component-side Connectors and Headers
Figure 16 shows the locations of the component-side connectors and headers.
A B CD
1
2 1 10 24
9
21
2 10
U T S
9
E F G H
1 3 1 2
16
21 1
I
1
2
10 25
J
1
2
1
K
4 1 2 1 4 1 1 9 2 1 9 2
R
Q
P
ON M
L
OM18315
Figure 16. Component-side Connectors and Headers
58
Technical Reference
Table 18 lists the component-side connectors and headers identified in Figure 16. Table 18. Component-side Connectors and Headers Shown in Figure 16
Item/callout from Figure 16
A B C D E F G H I J K L M N O P Q R S T U
Description
High Definition Audio Link header Serial ATA connectors [6] Front panel USB headers [2] Chassis intrusion header PCI Express x16 add-in card connector PCI Express x1 add-in card connector PCI Conventional bus add-in card connector 1 PCI Conventional bus add-in card connector 2 IEEE-1394a front panel header Diskette drive connector Parallel ATA IDE connector Serial port header Front panel header Front chassis fan header Auxiliary front panel power LED header Parallel port header Processor core power connector Processor fan connector Rear chassis fan header Main power connector Front panel audio header
59
Intel Desktop Board DQ965CO Technical Product Specification
Table 19. High Definition Audio Link Header
Pin
1 3 5 7 9 11 13 15
Signal Name
BCLK RST SYNC SDO SDI No connect No connect No connect
Pin
2 4 6 8 10 12 14 16
Signal Name
Ground 3.3 V/1.5 V I/O Ground 3.3V_CORE +12 V Key (no pin) 3.3 V/1.5V STBY Ground
Table 20. Serial ATA Connectors
Pin
1 2 3 4 5 6 7
Signal Name
Ground TXP TXN Ground RXN RXP Ground
Table 21. Chassis Intrusion Header
Pin
1 2
Signal Name
Intruder Ground
Table 22. Serial Port Header
Pin
1 3 5 7 9
Signal Name
DCD TXD# Ground RTS RI
Pin
2 4 6 8 10
Signal Name
RXD# DTR DSR CTS Key (no pin)
60
Technical Reference
Table 23. Parallel Port Header
Pin
1 3 5 7 9 11 13 15 17 19 21 23 25
Signal Name
STROBE# PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 ACK# BUSY PERROR SELECT
Pin
2 4 6 8 10 12 14 16 18 20 22 24 26
Signal Name
AUTOFD# FAULT# INIT# SLCTIN# Ground Ground Ground Ground Ground Ground Ground Ground Key (no pin)
Table 24. Front and Rear Chassis Fan Headers
Pin
1 2 3
Signal Name
Control +12 V Tach
Table 25. Processor Fan Header
Pin
1 2 3 4
Signal Name
Ground +12 V FAN_TACH FAN_CONTROL
Table 26. Front Panel Audio Header
Pin
1 3 5 7 9
Signal Name
[Port 1] Left channel [Port 1] Right channel [Port 2] Right channel SENSE_SEND (Jack detection) [Port 2] Left channel
Pin
2 4 6 8 10
Signal Name
Ground PRESENCE# (Dongle present) [Port 1] SENSE_RETURN Key (no pin) [Port 2] SENSE_RETURN
61
Intel Desktop Board DQ965CO Technical Product Specification
2.7.2.1
*
Add-in Card Connectors
The board has the following add-in card connectors: PCI Express x16: one connector supporting simultaneous transfer speeds up to 4 GBytes/sec of peak bandwidth per direction and up to 8 GBytes/sec concurrent bandwidth PCI Express x1: one PCI Express x1 connector. The x1 interface supports simultaneous transfer speeds up to 250 Mbytes/sec of peak bandwidth per direction and up to 500 MBytes/sec concurrent bandwidth PCI Conventional (rev 2.3 compliant) bus: two PCI Conventional bus add-in card connectors. The SMBus is routed to PCI Conventional bus connector 2 only. PCI Conventional bus add-in cards with SMBus support can access sensor data and other information residing on the board. All of the PCI Conventional bus connectors are bus master capable. SMBus signals are routed to PCI Conventional bus connector 2. This enables PCI Conventional bus add-in boards with SMBus support to access sensor data on the board. The specific SMBus signals are as follows: The SMBus clock line is connected to pin A40. The SMBus data line is connected to pin A41.
*
*
Note the following considerations for the PCI Conventional bus connectors: * *
62
Technical Reference
2.7.2.2
*
Power Supply Connectors
The board has the following power supply connectors: Main power - a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, attach that cable on the rightmost pins of the main power connector, leaving pins 11, 12, 23, and 24 unconnected. Processor core power - a 2 x 2 connector. This connector provides power directly to the processor voltage regulator and must always be used. Failure to do so will prevent the board from booting.
*
Table 27. Processor Core Power Connector
Pin
1 3
Signal Name
Ground +12 V
Pin
2 4
Signal Name
Ground +12 V
Table 28. Main Power Connector
Pin
1 2 3 4 5 6 7 8 9 10 11 12
Signal Name
+3.3 V +3.3 V Ground +5 V Ground +5 V Ground PWRGD (Power Good) +5 V (Standby) +12 V +12 V (Note) 2 x 12 connector detect (Note)
Pin
13 14 15 16 17 18 19 20 21 22 23 24
Signal Name
+3.3 V -12 V Ground PS-ON# (power supply remote on/off) Ground Ground Ground No connect +5 V +5 V +5 V (Note) Ground (Note)
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.
63
Intel Desktop Board DQ965CO Technical Product Specification
2.7.2.3
Front Panel Header
This section describes the functions of the front panel header. Table 29 lists the signal names of the front panel header. Figure 17 is a connection diagram for the front panel header. Table 29. Front Panel Header
Pin
1 3
Signal
HD_PWR HDA#
In/ Out
Out Out
Description
Hard disk LED pull-up to +5 V Hard disk active LED
Pin
2 4
Signal
HDR_BLNK_ GRN HDR_BLNK_ YEL
In/ Out
Power LED
Description
Front panel green LED Front panel yellow LED
Hard Drive Activity LED
Out Out
Reset Switch
On/Off Switch
5 7
Ground FP_RESET# In
Power
Ground Reset switch
6 8
FPBUT_IN Ground
In
Power switch Ground
Not Connected
9
+5 V
Power
10
N/C
Not connected
Hard Drive Activity LED
+ -
1 3 5 7 9
2 4 6 8
Singlecolored Power LED + Power Switch
Dualcolored Power LED +
Reset Switch
+5 V DC
N/C
OM18318
Figure 17. Connection Diagram for Front Panel Header 2.7.2.3.1 Hard Drive Activity LED Header
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires one of the following: * * A Serial ATA hard drive connected to an onboard Serial ATA connector A Parallel ATA IDE hard drive connected to an onboard Parallel ATA IDE connector
64
Technical Reference
2.7.2.3.2
Reset Switch Header
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.7.2.3.3 Power/Sleep LED Header
Pins 2 and 4 can be connected to a one- or two-color LED. Table 30 shows the possible states for a one-color LED. Table 31 shows the possible states for a two-color LED. Table 30. States for a One-Color Power LED
LED State
Off Steady Green
Description
Power off/sleeping Running
Table 31. States for a Two-Color Power LED
LED State
Off Steady Green Steady Yellow
Description
Power off Running Sleeping
NOTE
The colors listed in Table 30 and Table 31 are suggested colors only. Actual LED colors are product- or customer-specific. 2.7.2.3.4 Power Switch Header
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal.
2.7.2.4
Auxiliary Front Panel Power LED Header
Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header. Table 32. Auxiliary Front Panel Power LED Header
Pin
1 2 3
Signal Name
HDR_BLNK_GRN Not connected HDR_BLNK_YEL
In/Out
Out Out
Description
Front panel green LED Front panel yellow LED
65
Intel Desktop Board DQ965CO Technical Product Specification
2.7.2.5
Front Panel USB Headers
Figure 18 is a connection diagram for the front panel USB headers.
INTEGRATOR'S NOTES
* * The +5 V DC power on the front panel USB headers is fused. Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices.
Power (+5 V DC) One USB Port DD+ Ground Key (no pin) Power (+5 V DC) DD+ Ground No connect
OM18317
1 3 5 7
2 4 6 8
10
One USB Port
Figure 18. Connection Diagram for Front Panel USB Headers
2.7.2.6 Front Panel IEEE 1394a Header
Figure 19 is a connection diagram for the IEEE 1394a header.
TPA+ Ground TPB+ +12 V DC Key (no pin) 1 3 5 7 2 4 6 8 10 TPAGround TPB+12 V DC Ground
OM18316
Figure 19. Connection Diagram for IEEE 1394a Header
INTEGRATOR'S NOTES
* * The +12 V DC power on the IEEE 1394a header is fused. The IEEE 1394a header provides one IEEE 1394a port.
66
Technical Reference
2.8
Jumper Block
CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 20 shows the location of the jumper block. The jumper determines the BIOS Setup program's mode. Table 33 lists the jumper settings for the three modes: normal, configure, and recovery. When the jumper is set to configure mode and the computer is powered-up, the BIOS compares the processor version and the microcode version in the BIOS and reports if the two match.
1 2 3
OM18321
Figure 20. Location of the Jumper Block Table 33. BIOS Setup Configuration Jumper Settings
Function/Mode
Normal
Jumper Setting
1-2
Configuration
The BIOS uses current configuration information and passwords for booting.
123
Configure
2-3
After the POST runs, Setup runs automatically. The maintenance menu is displayed.
123
Recovery
None
123
The BIOS attempts to recover the BIOS configuration. Refer to Section 3.7 for more information on BIOS recovery.
67
Intel Desktop Board DQ965CO Technical Product Specification
2.9
2.9.1
Mechanical Considerations
Form Factor
The board is designed to fit into a BTX-form-factor chassis. Figure 21 illustrates the mechanical form factor of the board. Dimensions are given in inches [millimeters]. The outer dimensions are 10.40 inches by 10.50 inches [264.16 millimeters by 266.70 millimeters].
7.550 9.150 [191.77] [232.41] 0.250 [6.35]
0.00 0.00
10.000 [254.00]
9.550 [242.57] 10.250 [260.36] 0.200 [5.08] 2.275 [57.79] 10.200 [259.08]
OM18319
10.000 [254.00]
Figure 21. Board Dimensions
68
Technical Reference
2.9.2
I/O Shield
The back panel I/O shield for the board must meet specific dimension and material requirements. Systems based on this board need the back panel I/O shield to pass certification testing. Figure 22 shows the I/O shield for boards with the optional PS/2 connectors. Figure 23 shows the I/O shield for boards without the optional PS/2 connectors. Dimensions are given in millimeters [inches]. The figure indicates the position of each cutout. Additional design considerations for I/O shields relative to chassis requirements are described in the BTX specification.
NOTE
The I/O shield drawing is for reference only. I/O shields compliant with the BTX specification are available from Intel.
172.93 REF [6.808]
13.00 TYP [0.512] 169.98 +0.12/- 0.13 [6.692 +0.004/- 0.005] 1.00 [0.039]
6.09 [0.0240] 0.00 [0.000] 9.18 [0.036] 10.728 [0.4224]
51.86 [2.04] 71.877 [2.8298] 90.336 [3.5565] 4.157 [0.1636] 7.945 [0.3128] 110.582 [4.3536] 140.389 [5.5271]
9.18 [0.361] 11.55 [0.455]
0.00 [0.000]
39.89 +0.12/- 0.13 [1.570 +0.004/- 0.005]
42.84 REF [1.687]
13.50 [0.532]
3.530 [0.139]
OM18409
Figure 22. I/O Shield Dimensions for Boards with PS/2 Connectors
69
Intel Desktop Board DQ965CO Technical Product Specification
172.93 REF [6.808]
13.00 TYP [0.512] 169.98 +0.12/- 0.13 [6.692 +0.004/- 0.005]
1.00 [0.039]
6.09 [0.0240] 0.00 [0.000] 10.728 [0.4224]
9.18 [0.361] 11.55 [0.455]
71.877 [2.8298]
90.336 [3.5565]
4.157 [0.1636]
7.945 [0.3128]
39.89 +0.12/- 0.13 [1.570 +0.004/- 0.005]
42.84 REF [1.687]
13.50 [0.532]
3.530 [0.139]
110.582 [4.3536]
140.389 [5.5271]
0.00 [0.000]
OM18407
Figure 23. I/O Shield Dimensions for Boards without PS/2 Connectors
70
Technical Reference
2.10 Electrical Considerations
2.10.1 DC Loading
Table 34 lists the DC loading characteristics of the board. This data is based on a DC analysis of all active components within the board that impact its power delivery subsystems. The analysis does not include PCI add-in cards. Minimum values assume a light load placed on the board that is similar to an environment with no applications running and no USB current draw. Maximum values assume a load placed on the board that is similar to a heavy gaming environment with a 500 mA current draw per USB port. These calculations are not based on specific processor values or memory configurations but are based on the minimum and maximum current draw possible from the board's power delivery subsystems to the processor, memory, and USB ports. Use the datasheets for add-in cards, such as PCI, to determine the overall system power requirements. The selection of a power supply at the system level is dependent on the system's usage model and not necessarily tied to a particular processor speed. Table 34. DC Loading Characteristics
DC Current at: Mode DC Power -12 V +12 V1 +12 V2 (CPU) +5 V +3.3 v +5 VSB
Minimum loading Maximum loading
43.13 W 532.98 W
0.00 0.30
0.40 11.50
1.79 16.77
1.80 23.96
2.00 19.52
0.25 [S0] 0.25 [S3] 1.17 [S0] 3.89 [S3]
2.10.2
Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 35 lists the current capability of the fan headers. Table 35. Fan Header Current Capability
Fan Header
Processor fan Front chassis fan Rear chassis fan
Maximum Available Current
3.0 A 1.5 A 1.5 A
71
Intel Desktop Board DQ965CO Technical Product Specification
2.10.3
Add-in Board Considerations
The board is designed to provide 2 A (average) of +5 V current for each add-in board. The total +5 V current draw for add-in boards for a fully loaded board (all three expansion slots and the PCI Express x16 connector filled) must not exceed 8 A.
2.10.4
Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. System integrators should refer to the power usage values listed in Table 34 when selecting a power supply for use with the board. Additional power required will depend on configurations chosen by the integrator. The power supply must comply with the indicated parameters of the ATX form factor specification. * The potential relation between 3.3 VDC and +5 VDC power rails * The current capability of the +5 VSB line * All timing parameters * All voltage tolerances
72
Technical Reference
2.11 Thermal Considerations
CAUTION
This board requires the use of a BTX Type I or Type II Thermal Module for the processor. Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board's maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.13.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (shown in Figure 24) can reach a temperature of up to 85 oC in an open chassis.
73
Intel Desktop Board DQ965CO Technical Product Specification
Figure 24 shows the locations of the localized high temperature zones.
A
BC
E
Item A B C D E Description
D
OM18320
Intel 82Q965 GMCH Intel 82801HO ICH8DO 1.5 V core and front side bus voltage regulator areas Processor Processor voltage regulator area
Figure 24. Localized High Temperature Zones
74
Technical Reference
Table 36 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 36. Thermal Considerations for Components
Component
Processor Intel 82Q965 GMCH Intel 82801HO ICH8DO
Maximum Case Temperature
For processor case temperature, see processor datasheets and processor specification updates 97 oC (under bias) 105 oC (under bias)
For information about
Processor datasheets and specification updates
Refer to
Section 1.2, page 17
2.12 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 C. The Desktop Board DQ965CO MTBF is 102,973 hours.
75
Intel Desktop Board DQ965CO Technical Product Specification
2.13 Environmental
Table 37 lists the environmental specifications for the board. Table 37. Desktop Board DQ965CO Environmental Specifications
Parameter
Temperature
Specification
-40 C to +70 C 0 C to +55 C 50 g trapezoidal waveform Velocity change of 170 inches/second Half sine 2 millisecond Product weight (pounds) <20 21-40 41-80 81-100 Free fall (inches) 36 30 24 18 Velocity change (inches/sec) 167 152 136 118
Non-Operating Operating
Shock
Unpackaged Packaged
Vibration
Unpackaged Packaged
5 Hz to 20 Hz: 0.01 g Hz sloping up to 0.02 g Hz 20 Hz to 500 Hz: 0.02 g Hz (flat) 10 Hz to 40 Hz: 0.015 g Hz (flat) 40 Hz to 500 Hz: 0.015 g Hz sloping down to 0.00015 g Hz
76
3
Overview of BIOS Features
What This Chapter Contains
3.1 Introduction ................................................................................... 3.2 BIOS Flash Memory Organization ....................................................... 3.3 Resource Configuration .................................................................... 3.4 System Management BIOS (SMBIOS)................................................. 3.5 Legacy USB Support ........................................................................ 3.6 BIOS Updates ................................................................................. 3.7 BIOS Recovery................................................................................ 3.8 Boot Options................................................................................... 3.9 Adjusting Boot Speed....................................................................... 3.10 BIOS Security Features .................................................................... 77 78 78 79 80 80 81 82 83 84
3.1
Introduction
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, and Plug and Play support. The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as CO96510J.86A. When the BIOS Setup configuration jumper is set to configure mode and the computer is powered-up, the BIOS compares the CPU version and the microcode version in the BIOS and reports if the two match. The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the key after the Power-On Self-Test (POST) memory test begins and before the operating system boot begins. The menu bar is shown below. Maintenance Main Advanced Security Power Boot Exit
NOTE
The maintenance menu is displayed only when the board is in configure mode. Section 2.8 on page 67 shows how to put the board in configure mode.
77
Intel Desktop Board DQ965CO Technical Product Specification
Table 38 lists the BIOS Setup program menu features. Table 38. BIOS Setup Program Menu Bar
Maintenance Clears passwords and displays processor information Main Displays processor and memory configuration Advanced Configures advanced features available through the chipset Security Sets passwords and security features Power Configures power management features and power supply controls Boot Selects boot options Exit Saves or discards changes to Setup program options
Table 39 lists the function keys available for menu screens. Table 39. BIOS Setup Program Function Keys
BIOS Setup Program Function Key
<> or <> <> or <>
Description
Selects a different menu screen (Moves the cursor left or right) Selects an item (Moves the cursor up or down) Selects a field (Not implemented) Executes command or selects the submenu Load the default configuration values for the current menu Save the current values and exits the BIOS Setup program Exits the menu
3.2
BIOS Flash Memory Organization
The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 16 Mbit (2048 KB) flash memory device
3.3
3.3.1
Resource Configuration
PCI Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having to configure the system. When a user turns on the system after adding a PCI card, the BIOS automatically configures interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are considered to be available for use by the add-in card.
78
Overview of BIOS Features
3.3.2
PCI IDE Support
If you select Auto in the BIOS Setup program, the BIOS automatically sets up the PCI IDE connector with independent I/O channel support. The IDE interface supports hard drives up to ATA-66/100/133 and recognizes any ATAPI compliant devices, including CD-ROM drives, tape drives, and Ultra DMA drives. The BIOS determines the capabilities of each drive and configures them to optimize capacity and performance. To take advantage of the high capacities typically available today, hard drives are automatically configured for Logical Block Addressing (LBA) and to PIO Mode 3 or 4, depending on the capability of the drive. You can override the auto-configuration options by specifying manual configuration in the BIOS Setup program. To use ATA-66/100/133 features the following items are required: * * * An ATA-66/100/133 peripheral device An ATA-66/100/133 compatible cable ATA-66/100/133 operating system device drivers
NOTE
Do not connect an ATA device as a slave on the same IDE cable as an ATAPI master device. For example, do not connect an ATA hard drive as a slave to an ATAPI CD-ROM drive.
3.4
System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information: * * * * BIOS data, such as the BIOS revision level Fixed-system data, such as peripherals, serial numbers, and asset tags Resource data, such as memory size, cache size, and processor speed Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems, such as Windows NT*, require an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information.
79
Intel Desktop Board DQ965CO Technical Product Specification
3.5
Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating system's USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled. Legacy USB support operates as follows: 1. When you apply power to the computer, legacy support is disabled. 2. POST begins. 3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu. 4. POST completes. 5. The operating system loads. While the operating system is loading, USB keyboards and mice are recognized and may be used to configure the operating system. (Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.) 6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used. To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system's installation instructions.
3.6
*
BIOS Updates
Intel(R) Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a thumb drive or a USB hard drive), or a CD-ROM, or from the file location on the Web. Intel(R) Flash Memory Update Utility, which requires booting from DOS. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a thumb drive or a USB hard drive), or a CD-ROM.
The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site:
*
Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS update.
For information about
The Intel World Wide Web site
Refer to
Section 1.2, page 17
80
Overview of BIOS Features
3.6.1
Language Support
The BIOS Setup program and help messages are supported in US English. Additional languages are available in the Integrator's Toolkit utility. Check the Intel website for details.
3.6.2
Custom Splash Screen
During POST, an Intel(R) splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Integrator's Toolkit that is available from Intel can be used to create a custom splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.
For information about
The Intel World Wide Web site
Refer to
Section 1.2, page 17
3.7
BIOS Recovery
It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 40 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable. Table 40. Acceptable Drives/Media Types for BIOS Recovery
Media Type
CD-ROM drive connected to the Parallel ATA interface CD-ROM drive connected to the Serial ATA interface USB removable drive (a USB Thumb Drive, for example) USB diskette drive (with a 1.44 MB diskette) USB hard disk drive Legacy diskette drive (with a 1.44 MB diskette) connected to the legacy diskette drive interface
Can be used for BIOS recovery?
Yes Yes Yes No No No
For information about
BIOS recovery
Refer to
http://support.intel.com/support/motherboards/desktop
81
Intel Desktop Board DQ965CO Technical Product Specification
3.8
Boot Options
In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drives, CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device, the hard drive second, and the ATAPI CD-ROM third. The fourth device is disabled.
3.8.1
CD-ROM Boot
Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM format specification. Under the Boot menu in the BIOS Setup program, ATAPI CDROM is listed as a boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD in the CD-ROM drive, the system will attempt to boot from the next defined drive.
3.8.2
Network Boot
The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed. Pressing the key during POST automatically forces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full.
3.8.3
Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present: * * * Video adapter Keyboard Mouse
3.8.4
Changing the Default Boot Device During POST
Pressing the key during POST causes a boot device menu to be displayed. This menu displays the list of available boot devices (as set in the BIOS setup program's Boot Device Priority Submenu). Table 41 lists the boot device menu options. Table 41. Boot Device Menu Options
Boot Device Menu Function Keys
<> or <>
Description
Selects a default boot device Exits the menu, saves changes, and boots from the selected device Exits the menu without saving changes
82
Overview of BIOS Features
3.9
* *
Adjusting Boot Speed
Selecting and configuring peripherals properly Optimized BIOS boot parameters
These factors affect system boot speed:
3.9.1
* * *
Peripheral Selection and Configuration
Choose a hard drive with parameters such as "power-up to data ready" less than eight seconds, that minimize hard drive startup delays. Select a CD-ROM drive with a fast initialization rate. This rate can influence POST execution time. Eliminate unnecessary add-in adapter features, such as logo displays, screen repaints, or mode changes in POST. These features may add time to the boot process. Try different monitors. Some monitors initialize and communicate with the BIOS more quickly, which enables the system to boot more quickly.
The following techniques help improve system boot speed:
*
3.9.2
*
BIOS Boot Optimizations
In the Boot Menu, set the hard disk drive as the first boot device. As a result, the POST does not first seek a diskette drive, which saves about one second from the POST execution time. In the Peripheral Configuration submenu, disable the LAN device if it will not be used. This can reduce up to four seconds of option ROM boot time.
Use of the following BIOS Setup program settings reduces the POST execution time.
*
NOTE
It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen. This boot time may be so fast that some drives might be not be initialized at all. If this condition should occur, it is possible to introduce a programmable delay ranging from three to 30 seconds (using the Hard Disk Pre-Delay feature of the Advanced Menu in the Drive Configuration Submenu of the BIOS Setup program).
83
Intel Desktop Board DQ965CO Technical Product Specification
3.10 BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: * * * * The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode. The user password gives restricted access to view and change Setup options in the BIOS Setup program. This is the user mode. If only the supervisor password is set, pressing the key at the password prompt of the BIOS Setup program allows the user restricted access to Setup. If both the supervisor and user passwords are set, users can enter either the supervisor password or the user password to access Setup. Users have access to Setup respective to which password is entered. Setting the user password restricts who can boot the computer. The password prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, the user can enter either password to boot the computer. For enhanced security, use different passwords for the supervisor and user passwords. Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 16 characters in length.
*
* *
Table 42 shows the effects of setting the supervisor password and user password. This table is for reference only and is not displayed on the screen. Table 42. Supervisor and User Password Functions
Password Set
Neither Supervisor only User only Supervisor and user set Note:
Supervisor Mode
Can change all options (Note) Can change all options N/A Can change all options
User Mode
Can change all options (Note)
Setup Options
None
Password to Enter Setup
None Supervisor
Password During Boot
None None
Can change a Supervisor Password limited number of options Can change all options Enter Password Clear User Password
User Supervisor or user
User Supervisor or user
Can change a Supervisor Password limited number Enter Password of options
If no password is set, any user can change all Setup options.
84
4
Error Messages and Beep Codes
What This Chapter Contains
4.1 4.2 4.3 4.4 Speaker ......................................................................................... 85 BIOS Beep Codes ............................................................................ 85 BIOS Error Messages ....................................................................... 85 Port 80h POST Codes ....................................................................... 86
4.1
Speaker
The board-mounted speaker provides audible error code (beep code) information during POST.
For information about
The location of the onboard speaker
Refer to
Figure 1, page 14
4.2
BIOS Beep Codes
Whenever a recoverable error occurs during POST, the BIOS displays an error message describing the problem (see Table 43). Table 43. Beep Codes
Type
Memory error Thermal warning
Pattern
Three long beeps Four alternating beeps: High tone, low tone, high tone, low tone
Frequency
1280 Hz High tone: 2000 Hz Low tone: 1600 Hz
4.3
BIOS Error Messages
Table 44 lists the error messages and provides a brief description of each. Table 44. BIOS Error Messages
Error Message
CMOS Battery Low CMOS Checksum Bad Memory Size Decreased No Boot Device Available
Explanation
The battery may be losing power. Replace the battery soon. The CMOS checksum is incorrect. CMOS memory may have been corrupted. Run Setup to reset values. Memory size has decreased since the last boot. If no memory was removed then memory may be bad. System did not find a device to boot.
85
Intel Desktop Board DQ965CO Technical Product Specification
4.4
Port 80h POST Codes
During the POST, the BIOS generates diagnostic progress codes (POST-codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST-codes requires a PCI bus add-in card, often called a POST card. The POST card can decode the port and display the contents on a medium such as a seven-segment display.
NOTE
The POST card must be installed in PCI bus connector 1. The following tables provide information about the POST codes generated by the BIOS: * * * Table 45 lists the Port 80h POST code ranges Table 46 lists the Port 80h POST codes themselves Table 47 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal. Table 45. Port 80h POST Code Ranges
Range
00 - 0F 10 - 1F 20 - 2F 30 - 3F 40 - 4F 50 - 5F 60 - 6F 70 - 7F 80 - 8F 90 - 9F A0 - AF B0 - BF C0 - CF D0 - DF E0 - FF
Category/Subsystem
Debug codes: Can be used by any PEIM/driver for debug. Host Processors: 1F is an unrecoverable CPU error. Memory/Chipset: 2F is no memory detected or no useful memory detected. Recovery: 3F indicated recovery failure. Reserved for future use. I/O Busses: PCI, USB, ISA, ATA, etc. 5F is an unrecoverable error. Start with PCI. Reserved for future use (for new busses). Output Devices: All output consoles. 7F is an unrecoverable error. Reserved for future use (new output console codes). Input devices: Keyboard/Mouse. 9F is an unrecoverable error. Reserved for future use (new input console codes). Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error. Reserved for future use. Boot device selection. F0 - FF: FF processor exception. E0 - EE: Miscellaneous codes. See Table 46. EF boot/S3: resume failure.
86
Error Messages and Beep Codes
Table 46. Port 80h POST Codes
POST Code
10 11 12 13 21 22 23 24 25 26 27 28 50 51 52 53 - 57 58 59 5A 5B 5C 5D 70 71 72 78 79 7A
Description of POST Operation
Host Processor
Power-on initialization of the host processor (Boot Strap Processor) Host processor Cache initialization (including APs) Starting Application processor initialization SMM initialization
Chipset
Initializing a chipset component
Memory
Reading SPD from memory DIMMs Detecting presence of memory DIMMs Programming timing parameters in the memory controller and the DIMMs Configuring memory Optimizing memory settings Initializing memory, such as ECC init Testing memory
PCI Bus
Enumerating PCI busses Allocating resources to PCI bus Hot Plug PCI controller initialization Reserved for PCI Bus
USB
Resetting USB bus Reserved for USB
ATA/ATAPI/SATA
Resetting PATA/SATA bus and all devices Reserved for ATA
SMBus
Resetting SMBUS Reserved for SMBUS
Local Console
Resetting the VGA controller Disabling the VGA controller Enabling the VGA controller
Remote Console
Resetting the console controller Disabling the console controller Enabling the console controller
continued
87
Intel Desktop Board DQ965CO Technical Product Specification
Table 46. Port 80h POST Codes (continued)
POST Code
90 91 92 93 94 95 98 99 9A 9B B0 B1 B2 B3 B8 B9 BA BC Dy E0 E2 E1, E3 E4 E5 E6
Description of POST Operation
Keyboard (PS2 or USB)
Resetting keyboard Disabling keyboard Detecting presence of keyboard Enabling the keyboard Clearing keyboard input buffer Instructing keyboard controller to run Self Test (PS2 only)
Mouse (PS2 or USB)
Resetting mouse Disabling mouse Detecting presence of mouse Enabling mouse
Fixed Media
Resetting fixed media Disabling fixed media Detecting presence of a fixed media (IDE hard drive detection etc.) Enabling/configuring a fixed media
Removable media
Resetting removable media Disabling removable media Detecting presence of a removable media (IDE, CD-ROM detection, etc.) Enabling/configuring a removable media
BDS
Trying boot selection y (y=0 to 15)
PEI Core
Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN EFI_SW_PEI_PC_HANDOFF_TO_NEXT) Permanent memory found Reserved for PEI/PEIMs
DXE Core
Entered DXE phase Started dispatching drivers Started connecting drivers
continued
88
Error Messages and Beep Codes
Table 46. Port 80h POST Codes (continued)
POST Code
E7 E8 E9 EB F4 F5 F8 F9 FA 30 31 34 35 3F
Description of POST Operation
DXE Drivers
Waiting for user input Checking password Entering BIOS setup Calling Legacy Option ROMs
Runtime Phase/EFI OS Boot
Entering Sleep state Exiting Sleep state EFI boot service ExitBootServices ( ) has been called EFI runtime service SetVirtualAddressMap ( ) has been called EFI runtime service ResetSystem ( ) has been called
PEIMs/Recovery
Crisis Recovery has initiated per User request Crisis Recovery has initiated by software (corrupt flash) Loading recovery capsule Handing off control to the recovery capsule Unable to recover
89
Intel Desktop Board DQ965CO Technical Product Specification
Table 47. Typical Port 80h POST Sequence
POST Code
21 22 23 25 28 34 E4 12 13 50 51 92 90 94 95 EB 58 5A 92 90 94 5A 28 90 94 E7 01 00
Description
Initializing a chipset component Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase Starting Application processor initialization SMM initialization Enumerating PCI busses Allocating resourced to PCI bus Detecting the presence of the keyboard Resetting keyboard Clearing keyboard input buffer Keyboard Self Test Calling Video BIOS Resetting USB bus Resetting PATA/SATA bus and all devices Detecting the presence of the keyboard Resetting keyboard Clearing keyboard input buffer Resetting PATA/SATA bus and all devices Testing memory Resetting keyboard Clearing keyboard input buffer Waiting for user input INT 19 Ready to boot.
90
5
Regulatory Compliance and Battery Disposal Information
What This Chapter Contains
5.1 Regulatory Compliance..................................................................... 91 5.2 Battery Disposal Information............................................................. 99
5.1
* * * * *
Regulatory Compliance
Safety regulations European Union Declaration of Conformity statement Product Ecology statements Electromagnetic Compatibility (EMC) regulations Product certification markings
This section contains the following regulatory compliance information for Desktop Board DQ965CO:
5.1.1
Safety Regulations
Desktop Board DQ965CO complies with the safety regulations stated in Table 48 when correctly installed in a compatible host system. Table 48. Safety Regulations
Regulation
UL 60950-1:2003/ CSA C22.2 No. 60950-1-03 EN 60950-1:2002 IEC 60950-1:2001, First Edition
Title
Information Technology Equipment - Safety - Part 1: General Requirements (USA and Canada) Information Technology Equipment - Safety - Part 1: General Requirements (European Union) Information Technology Equipment - Safety - Part 1: General Requirements (International)
91
Intel Desktop Board DQ965CO Technical Product Specification
5.1.2
European Union Declaration of Conformity Statement
We, Intel Corporation, declare under our sole responsibility that the product Intel(R) Desktop Board DQ965CO is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 89/336/EEC (EMC Directive) and Council Directive 73/23/EEC (Safety/Low Voltage Directive). The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 89/336/EEC and 73/23/EEC. etina Tento vyrobek odpovida poadavkm evropskych smrnic 89/336/EEC a 73/23/EEC. Dansk Dette produkt er i overensstemmelse med det europaeiske direktiv 89/336/EEC & 73/23/EEC. Dutch Dit product is in navolging van de bepalingen van Europees Directief 89/336/EEC & 73/23/EEC. Eesti Antud toode vastab Euroopa direktiivides 89/336/EEC ja 73/23/EEC kehtestatud nouetele. Suomi Tama tuote noudattaa EU-direktiivin 89/336/EEC & 73/23/EEC maarayksia. Francais Ce produit est conforme aux exigences de la Directive Europeenne 89/336/EEC & 73/23/EEC. Deutsch Dieses Produkt entspricht den Bestimmungen der Europaischen Richtlinie 89/336/EEC & 73/23/EEC. 89/336/ 73/23/. Magyar E termek megfelel a 89/336/EEC es 73/23/EEC Europai Iranyelv elirasainak. Icelandic essi vara stenst regluger Evropska Efnahags Bandalagsins numer 89/336/ EEC & 73/23/EEC. Italiano Questo prodotto e conforme alla Direttiva Europea 89/336/EEC & 73/23/EEC. Latvieu Sis produkts atbilst Eiropas Direktvu 89/336/EEC un 73/23/EEC noteikumiem. Lietuvi Sis produktas atitinka Europos direktyv 89/336/EEC ir 73/23/EEC nuostatas. Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 89/336/EEC u 73/23/EEC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 89/336/ EEC & 73/23/EEC.
92
Regulatory Compliance and Battery Disposal Information
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 89/336/EWG i 73/23/EWG. Portuguese Este produto cumpre com as normas da Diretiva Europeia 89/336/EEC & 73/23/EEC. Espanol Este producto cumple con las normas del Directivo Europeo 89/336/EEC & 73/23/EEC. Slovensky Tento produkt je v sulade s ustanoveniami europskych direktiv 89/336/EEC a 73/23/EEC. Slovenina Izdelek je skladen z dolobami evropskih direktiv 89/336/EGS in 73/23/EGS. Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 89/336/EEC & 73/23/EEC. Turkce Bu urun, Avrupa Birlii'nin 89/336/EEC ve 73/23/EEC yonergelerine uyar.
93
Intel Desktop Board DQ965CO Technical Product Specification
5.1.3
Product Ecology Statements
The following information is provided to address worldwide product ecology concerns and regulations.
5.1.3.1
Disposal Considerations
This product contains the following materials that may be regulated upon disposal: lead solder on the printed wiring board assembly.
5.1.3.2
Recycling Considerations
As part of its commitment to environmental responsibility, Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intel's branded products to return used products to select locations for proper recycling. Please consult the http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc. Intel Product Recycling Program http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm Deutsch Als Teil von Intels Engagement fur den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermoglicht, gebrauchte Produkte an ausgewahlte Standorte fur ordnungsgemaes Recycling zuruckzugeben. Details zu diesem Programm, einschlielich der darin eingeschlossenen Produkte, verfugbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm
Espanol Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. Consulte la http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envio, terminos y condiciones, etc.
94
Regulatory Compliance and Battery Disposal Information
Francais Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en oeuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits uses en les retournant a des adresses specifiees. Visitez la page Web
http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm pour en savoir
plus sur ce programme, a savoir les produits concernes, les adresses disponibles, les instructions d'expedition, les conditions generales, etc.
http://www.intel.com/intel /other/ehs/product_ecology/Recycling_Program.htm Malay Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran, Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul. Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb. Portuguese Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos sao reciclados de maneira adequada. Consulte o site http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm (em Ingles) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponiveis, as instrucoes de envio, os termos e condicoes, etc. Russian , Intel Intel (Product Recycling Program) Intel . , -
http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm
, , , , ..
95
Intel Desktop Board DQ965CO Technical Product Specification
Turkce Intel, cevre sorumluluuna baimliliinin bir parcasi olarak, perakende tuketicilerin Intel markali kullanilmi urunlerini belirlenmi merkezlere iade edip uygun ekilde geri donuturmesini amaclayan Intel Urunleri Geri Donuum Programi'ni uygulamaya koymutur. Bu programin urun kapsami, urun iade merkezleri, nakliye talimatlari, kayitlar ve artlar v.s dahil butun ayrintilarini ogrenmek icin lutfen
http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm
Web sayfasina gidin.
5.1.3.3
Lead Free Desktop Board
This desktop board is lead free although certain discrete components used on the board contain a small amount of lead which is necessary for component performance and/or reliability. This desktop board is referred to as "Lead-free second level interconnect." The board substrate and the solder connections from the board to the components (second-level connections) are all lead free. Table 49 shows the various forms of the "Lead-Free 2nd Level Interconnect" mark as it appears on the board and accompanying collateral. Table 49. Lead-Free Board Markings
Description
Lead-Free 2 Level Interconnect: This symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in the desktop board substrate and the solder connections from the board to the components (second-level interconnect) is not greater than 0.1% by weight (1000 ppm).
nd
Mark
or
or
96
Regulatory Compliance and Battery Disposal Information
5.1.4
EMC Regulations
Desktop Board DQ965CO complies with the EMC regulations stated in Table 50 when correctly installed in a compatible host system. Table 50. EMC Regulations
Regulation
FCC Class B ICES-003 (Class B) EN55022: 1998 (Class B) EN55024: 1998 AS/NZS CISPR 22 (Class B) CISPR 22, 3rd Edition, (Class B) CISPR 24: 1997 VCCI (Class B)
Title
Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B, Radio Frequency Devices. (USA) Interference-Causing Equipment Standard, Digital Apparatus. (Canada) Limits and methods of measurement of Radio Interference Characteristics of Information Technology Equipment. (European Union) Information Technology Equipment - Immunity Characteristics Limits and methods of measurement. (European Union) Australian Communications Authority, Standard for Electromagnetic Compatibility. (Australia and New Zealand) Limits and methods of measurement of Radio Disturbance Characteristics of Information Technology Equipment. (International) Information Technology Equipment - Immunity Characteristics - Limits and Methods of Measurement. (International) Voluntary Control for Interference by Information Technology Equipment. (Japan)
Japanese Kanji statement translation: this is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.
97
Intel Desktop Board DQ965CO Technical Product Specification
Korean Class B statement translation: this is household equipment that is certified to comply with EMC requirements. You may use this equipment in residential environments and other non-residential environments.
5.1.5
Product Certification Markings (Board Level)
Desktop Board DQ965CO has the product certification markings shown in Table 51: Table 51. Product Certification Markings
Description
UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel desktop boards: E210882. FCC Declaration of Conformity logo mark for Class B equipment. Includes Intel name and DQ965CO model designation.
Mark
CE mark. Declaring compliance to European Union (EU) EMC directive (89/336/EEC) and Low Voltage directive (73/23/EEC).
Australian Communications Authority (ACA) C-tick mark. Includes adjacent Intel supplier code number, N-232.
Japan VCCI (Voluntary Control Council for Interference) mark.
S. Korea MIC (Ministry of Information and Communication) mark. Includes adjacent MIC certification number: CPU-DQ965CO
For information about MIC certification, go to http://support.intel.com/support/motherboards/desktop/ Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark. Includes adjacent Intel company number, D33025. Printed wiring board manufacturer's recognition mark. Consists of a unique UL recognized manufacturer's logo, along with a flammability rating (solder side). V-0
98
Regulatory Compliance and Battery Disposal Information
5.2
Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.
PRECAUTION
Risque d'explosion si la pile usagee est remplacee par une pile de type incorrect. Les piles usagees doivent etre recyclees dans la mesure du possible. La mise au rebut des piles usagees doit respecter les reglementations locales en vigueur en matiere de protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bor om muligt genbruges. Bortskaffelse af brugte batterier bor forega i overensstemmelse med gaeldende miljolovgivning.
OBS!
Det kan oppsta eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bor kastes i henhold til gjeldende miljolovgivning.
VIKTIGT!
Risk for explosion om batteriet ersatts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljovardsbestammelserna.
VARO
Rajahdysvaara, jos pariston tyyppi on vaara. Paristot on kierratettava, jos se on mahdollista. Kaytetyt paristot on havitettava paikallisten ymparistomaaraysten mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.
99
Intel Desktop Board DQ965CO Technical Product Specification
PRECAUCION
Existe peligro de explosion si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENCAO
Havera risco de explosao se a bateria for substituida por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminacao de baterias usadas deve ser feita de acordo com as regulamentacoes ambientais da regiao.
ACIAROZZNA
, . , , . .
UPOZORNINI
V pipad vymny baterie za nespravny druh me dojit k vybuchu. Je-li to mone, baterie by mly byt recyklovany. Baterie je teba zlikvidovat v souladu s mistnimi pedpisy o ivotnim prostedi.
. . .
VIGYAZAT
Ha a telepet nem a megfelel tipusu telepre csereli, az felrobbanhat. A telepeket lehetseg szerint ujra kell hasznositani. A hasznalt telepeket a helyi kornyezetvedelmi elirasoknak megfelelen kell kiselejtezni.
100
Regulatory Compliance and Battery Disposal Information
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan.
OSTRZEENIE
Istnieje niebezpieczestwo wybuchu w przypadku zastosowania niewaciwego typu baterii. Zuyte baterie naley w miar moliwoci utylizowa zgodnie z odpowiednimi przepisami ochrony rodowiska.
PRECAUIE
Risc de explozie, dac bateria este inlocuit cu un tip de baterie necorespunztor. Bateriile trebuie reciclate, dac este posibil. Depozitarea bateriilor uzate trebuie s respecte reglementrile locale privind protecia mediului.
. . , .
UPOZORNENIE
Ak bateriu vymenite za nespravny typ, hrozi nebezpeenstvo jej vybuchu. Baterie by sa mali poda monosti vdy recyklova. Likvidacia pouitych baterii sa musi vykonava v sulade s miestnymi predpismi na ochranu ivotneho prostredia.
POZOR
Zamenjava baterije z baterijo druganega tipa lahko povzroi eksplozijo. e je mogoe, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi.
.
UYARI
Yanli turde pil takildiinda patlama riski vardir. Piller mumkun olduunda geri donuturulmelidir. Kullanilmi piller, yerel cevre yasalarina uygun olarak atilmalidir.
O
, . , . , .
101
Intel Desktop Board DQ965CO Technical Product Specification
102

▲Up To Search▲

Price & Availability of DQ965CO

	To Download DQ965CO Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .